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CD40257BM96G4

Texas Instruments

CD40257BM96G4 by Texas Instruments

CD40257BM96G4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 300 ns at 5V. It operates in a temperature range of -55 to 125°C and supports power supplies of 5/15V. Ideal for military-grade applications requiring high-speed signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,177 parts In-Stock

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Digiode

USA . 812 parts In-Stock

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Native Components

USA . 332 parts In-Stock

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$0.711

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Northwest PG Solutions

USA . 156 parts In-Stock

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$0.782

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One Stop Electronics

USA . 1,608 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 682 parts In-Stock

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Parana Technologies

USA . 2,073 parts In-Stock

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$20.552

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$20.635

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DigiPath Technology Company

USA . 779 parts In-Stock

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$22.630

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$20.820

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ChromeModa Solutions

Germany . 5,597 parts In-Stock

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$23.092

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$18.935

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IDEA Electronic Components Group

UK . 1,105 parts In-Stock

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$23.092

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$21.937

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$20.783

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Component Stockers USA

USA . 606 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Enhance your electronics projects with the CD40257BM96G4 by Texas Instruments. This high-quality multiplexer & demultiplexer offers superior performance and reliability, thanks to the reputable manufacturer's expertise in the field. Perfect for a wide range of applications, this versatile component provides customers with value, efficiency, and seamless integration. Upgrade your designs with the CD40257BM96G4 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer & demultiplexer.

Propagation Delay At Nominal Supply: 300 ns

Low propagation delay ensures fast switching between inputs and outputs.

No. of Functions: 4

Allows for multiple functions to be performed with a single component, saving space and reducing overall cost.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltages, making it easy to integrate into existing systems.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance state, providing flexibility in controlling the output signal.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer & demultiplexer energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer CD40257BM96G4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD40257BM96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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