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CD40257BM96

Texas Instruments

CD40257BM96 by Texas Instruments

CD40257BM96 by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at 5V supply voltage. It has a propagation delay of 300ns and supports a load capacitance of 50pF. Ideal for military applications due to its CMOS technology and wide temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

USA . 4,947 parts In-Stock

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Vyrian

USA . 2,314 parts In-Stock

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AZTECH Wire

Italy . 582 parts In-Stock

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$7.945

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Native Components

USA . 416 parts In-Stock

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$9.330

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Northwest PG Solutions

USA . 1,735 parts In-Stock

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$10.263

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$9.237

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One Stop Electronics

USA . 1,555 parts In-Stock

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Parana Technologies

USA . 2,195 parts In-Stock

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$27.513

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$2,555.042

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$24.762

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DigiPath Technology Company

USA . 720 parts In-Stock

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$30.296

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$27.872

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IDEA Electronic Components Group

UK . 2,367 parts In-Stock

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$30.914

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$29.368

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$27.823

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ChromeModa Solutions

Germany . 1,849 parts In-Stock

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$25.349

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the CD40257BM96 multiplexer & demultiplexer. This versatile component offers seamless integration in a wide range of applications, providing customers with efficient signal routing and data management. With its small outline package style and dual terminal position, this product is designed for convenience and ease of use. Trust Texas Instruments to deliver innovative solutions that exceed expectations and enhance your electronic projects. Choose the CD40257BM96 for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the product's longevity.

Propagation Delay at Nominal Supply: 300 ns

Low propagation delay ensures quick signal processing, making it suitable for time-sensitive applications.

Surface Mount: YES

Easy installation and space-saving design due to surface mount capability.

No. of Functions: 4

Can handle multiple functions simultaneously, increasing flexibility in signal routing.

No. of Inputs: 2

Sufficient number of inputs for a variety of data routing applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, compatible with many systems.

Load Capacitance (CL): 50 pF

Can handle a moderate load capacitance, ensuring stable signal transmission.

Power Supplies (V): 5/15

Compatible with different power supply options, offering versatility in system design.

No. of Terminals: 16

Provides ample connection points for input and output signals.

Package Style (Meter): SMALL OUTLINE

Compact package design saves space on the circuit board, ideal for dense layouts.

Output Characteristics: 3-STATE

Supports three output states for better control over signal routing.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold environments, making it suitable for a wide range of applications.

Maximum Seated Height: 1.75 mm

Low-profile design saves space and allows for more compact electronic devices.

Width: 3.9 mm

Narrow width allows for efficient use of circuit board real estate.

Output Polarity: TRUE

Ensures correct signal polarity for seamless integration with other components.

Maximum Supply Voltage (Vsup): 18 V

Can handle higher supply voltages, providing flexibility in power requirements.

Technical Specifications

Multiplexer & Demultiplexer CD40257BM96 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD40257BM96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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