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SN74HC153PWR

Texas Instruments

SN74HC153PWR by Texas Instruments

SN74HC153PWR by Texas Instruments is a CMOS multiplexer/demultiplexer with 4 inputs, 2 functions, and 4 bits. It operates at a nominal voltage of 5V with a propagation delay of 38ns. This industrial-grade component is ideal for applications requiring fast signal switching in compact designs.

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Texas Instruments

USA . 215,974 parts In-Stock

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Arrow

USA . 1,250 parts In-Stock

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$0.568

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$0.308

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$0.228

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$0.568

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DigiKey

USA . 1,229 parts In-Stock

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$0.580

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$0.320

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$0.277

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$0.248

1,229

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Mouser Electronics

USA . 335 parts In-Stock

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$0.580

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$0.320

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$0.298

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335

$0.580

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Rochester

USA . 1,782 parts In-Stock

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$0.307

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Verical

USA . 1,585 parts In-Stock

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Digiode

USA . 2,351 parts In-Stock

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$0.132

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 56,120 parts In-Stock

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Chip Stock

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Mil-Aero Solutions, Inc.

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ACDS - Activité Composants Distribution Service

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Inventory MP

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Bristol Electronics

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Classic Components Corporation

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GSS - Global Semi Support

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Ampacity Inc.

Singapore . 56,249 parts In-Stock

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$0.118

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Semicontronic

India . 55,977 parts In-Stock

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Corphita

USA . 4,116 parts In-Stock

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Argo Parts USA

USA . 3,441 parts In-Stock

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Continental Prestige Electronics

USA . 1,098 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Parana Technologies

USA . 2,053 parts In-Stock

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$16.552

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$16.829

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DigiPath Technology Company

USA . 1,210 parts In-Stock

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ChromeModa Solutions

Germany . 6,379 parts In-Stock

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IDEA Electronic Components Group

UK . 2,253 parts In-Stock

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Corohmni

South Africa . 852 parts In-Stock

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

UK . 524 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Overview

Elevate your electronics with the Texas Instruments SN74HC153PWR multiplexer/demultiplexer. Crafted with precision and expertise, this innovative component offers unparalleled performance and reliability. Whether you're designing a complex circuit or simplifying your system, this product delivers exceptional value and efficiency. Unlock endless possibilities in industrial applications, automation systems, and more with the cutting-edge technology of Texas Instruments. Experience the difference with the SN74HC153PWR - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and reliable for long-term use.

Propagation Delay At Nominal Supply: 38 ns

Low propagation delay ensures fast and efficient signal processing in the multiplexing and demultiplexing operations.

No. of Functions: 2

Having 2 functions in one device allows for more versatile usage and efficient circuit design.

No. of Inputs: 4

4 input channels provide flexibility in connecting multiple input sources to the device.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the device compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability under various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for this product.

Technical Specifications

Multiplexer & Demultiplexer SN74HC153PWR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

274 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC153PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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