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CD40257BD

Texas Instruments

CD40257BD by Texas Instruments

CD40257BD by Texas Instruments is a 4-function, 2-input multiplexer with 16 terminals. It operates at supply voltages b/w 3V to 18V and has a propagation delay of 300ns. Ideal for military-grade applications, this CMOS technology chip can withstand temperatures from -55°C to 125°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 5,046 parts In-Stock

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Digiode

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Electronic Expediters

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Bristol Electronics

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Mentor Electronics Marketing, LLC

USA . 3 parts In-Stock

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AZTECH Wire

Italy . 270 parts In-Stock

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$15.977

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Native Components

USA . 742 parts In-Stock

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Northwest PG Solutions

USA . 1,673 parts In-Stock

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Parana Technologies

USA . 250 parts In-Stock

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DigiPath Technology Company

USA . 1,128 parts In-Stock

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$30.420

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ChromeModa Solutions

Germany . 5,611 parts In-Stock

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$31.041

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IDEA Electronic Components Group

UK . 1,976 parts In-Stock

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One Stop Electronics

USA . 1,086 parts In-Stock

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Corphita

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Supply Digital

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Overview

Experience top-notch quality and performance with the CD40257BD by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer offers unparalleled reliability and precision for a wide range of applications. With its advanced technology and military-grade temperature grade, this product ensures optimal functionality in extreme conditions. Enhance your projects with the value and benefits that only Texas Instruments can provide, and elevate your design to new heights with the CD40257BD.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and resistance to temperature fluctuations, making the product suitable for a variety of operating conditions.

No. of Functions: 4

Having multiple functions in one device increases efficiency and saves space in the circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with other components easier and more stable.

Propagation Delay (tpd): 300 ns

With a relatively low propagation delay, this multiplexer/demultiplexer can rapidly process signals, reducing latency in the system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to be used in demanding environments without risk of overheating.

Output Characteristics: 3-STATE

The 3-state output allows the output of the device to be in one of three states (high, low, or high impedance), providing flexibility in controlling the signal flow.

Temperature Grade: MILITARY

Meeting military-grade specifications ensures reliability, performance, and durability under extreme conditions, making it suitable for critical applications.

Technical Specifications

Multiplexer & Demultiplexer CD40257BD attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD40257BD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-120-8685, 5962011208685

NIIN

011208685

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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