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SN74LVC257APWG4

Texas Instruments

SN74LVC257APWG4 by Texas Instruments

SN74LVC257APWG4 by Texas Instruments is a 4:1 multiplexer with 2 inputs, operating at a supply voltage of 3.3V. It features a propagation delay of 4.6ns, output current of 24A, and operates in industrial temperature range (-40 to 85°C). This CMOS technology device is ideal for applications requiring high-speed signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,234 parts In-Stock

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Digiode

USA . 4,238 parts In-Stock

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AZTECH Wire

Italy . 884 parts In-Stock

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$19.145

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Parana Technologies

USA . 1,869 parts In-Stock

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DigiPath Technology Company

USA . 829 parts In-Stock

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$24.597

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One Stop Electronics

USA . 1,468 parts In-Stock

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ChromeModa Solutions

Germany . 4,917 parts In-Stock

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IDEA Electronic Components Group

UK . 1,228 parts In-Stock

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$22.589

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Perfect Parts

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Overview

Discover the power and precision of the SN74LVC257APWG4 multiplexer by Texas Instruments. Crafted with top-notch quality and cutting-edge technology, this versatile device offers unmatched performance in a variety of applications. From data acquisition to signal routing, this multiplexer delivers seamless operation and reliable results. Make the smart choice for your next project and experience the value and benefits that only Texas Instruments can provide. Elevate your designs with the SN74LVC257APWG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 4.6 ns

Low propagation delay allows for fast data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in a single device provides versatility and flexibility in signal routing and processing.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a commonly used supply voltage of 3.3V ensures compatibility with a wide range of systems and devices.

Output Characteristics: 3-STATE

The 3-STATE output allows for tri-state logic control, enabling efficient bus sharing and signal isolation.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can reliably function in extreme cold environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in hot conditions, increasing the product's overall reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer/demultiplexer energy-efficient and reliable in noisy environments.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, the product has a built-in safety margin, protecting it from potential voltage spikes or fluctuations.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC257APWG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC257APWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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