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76038012X

Texas Instruments

76038012X by Texas Instruments

The Texas Instruments 76038012X is a TTL multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 17ns. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,372 parts In-Stock

1+ parts

-

100+ parts

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5,372

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Digiode

USA . 2,206 parts In-Stock

1+ parts

-

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2,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 343 parts In-Stock

1+ parts

$0.840

100+ parts

-

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343

$0.840

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Northwest PG Solutions

USA . 1,052 parts In-Stock

1+ parts

$0.924

100+ parts

-

1k+ parts

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1,052

$0.924

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Parana Technologies

USA . 833 parts In-Stock

1+ parts

$10.791

100+ parts

-

1k+ parts

$11.273

10k+ parts

-

833

$10.791

-

$11.273

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DigiPath Technology Company

USA . 1,372 parts In-Stock

1+ parts

$11.882

100+ parts

-

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1,372

$11.882

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ChromeModa Solutions

Germany . 3,732 parts In-Stock

1+ parts

$12.125

100+ parts

$9.942

1k+ parts

-

10k+ parts

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3,732

$12.125

$9.942

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$12.125

100+ parts

$11.519

1k+ parts

$10.912

10k+ parts

-

194

$12.125

$11.519

$10.912

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AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$12.331

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783

$12.331

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One Stop Electronics

USA . 601 parts In-Stock

1+ parts

$32.000

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601

$32.000

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Corphita

USA . 689 parts In-Stock

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689

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Overview

Unleash the power of innovation with the 76038012X by Texas Instruments. This high-quality Multiplexer & Demultiplexer offers unparalleled performance and reliability, thanks to the renowned manufacturer's cutting-edge technology. Perfect for a variety of applications, this versatile chip carrier is the ultimate solution for your electronic needs. Experience seamless operation, fast propagation delay, and inverted output characteristics that will take your projects to the next level. Elevate your designs with Texas Instruments and discover the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for harsh environmental conditions.

No. of Functions: 4

With 4 functions in one device, it offers multiplexing and demultiplexing capabilities efficiently and effectively, saving space and cost.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most systems and easy to integrate.

Propagation Delay (tpd): 17 ns

Low propagation delay of 17 ns ensures fast data processing and smooth operation.

Temperature Grade: MILITARY

Military-grade temperature range of -55 to 125°C ensures the product's reliability in extreme conditions.

Technical Specifications

Multiplexer & Demultiplexer 76038012X attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

8.89 mm

Trade Compliance

76038012X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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