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SN74LS258N

Onsemi

SN74LS258N by Onsemi

MULTIPLEXER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$3.288

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 3,049 parts In-Stock

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Freelance Electronics

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Digiode

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Electronic Expediters

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Pride Electronics

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Nova Conductors

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Vyrian

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Standard Data Resources

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Bristol Electronics

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ABC Electronics Ltd.

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Inland Empire Components Inc.

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Mentor Electronics Marketing, LLC

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ICP Electronique

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Resion

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Mil-Aero Solutions, Inc.

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Q Components

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Manoshevitz Elec. Sales

Israel . 42 parts In-Stock

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ComSIT Distribution GmbH

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EMSNET

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A2Z Electronics, Inc.

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Prism Electronics

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Holdelec - ElecDif-Pro

France . 15 parts In-Stock

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M&R Communications

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Corel Iberica Componentes, S.L.

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MISTER SPROCKETS

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ECAB

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Distributors (Availability)

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Corohmni

South Africa . 107 parts In-Stock

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AZTECH Wire

Italy . 469 parts In-Stock

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Semicontronic

India . 1,537 parts In-Stock

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One Stop Electronics

USA . 1,379 parts In-Stock

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Parana Technologies

USA . 48 parts In-Stock

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DigiPath Technology Company

USA . 975 parts In-Stock

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IDEA Electronic Components Group

UK . 2,189 parts In-Stock

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ChromeModa Solutions

Germany . 143 parts In-Stock

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SupplyDigital Components

Austria . 7,473 parts In-Stock

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Problanco Electronics

Mexico . 7,450 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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TANS Electronics

Latvia . 3,122 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 798 parts In-Stock

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Kepictronics

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Bastille Electronics

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Perfect Parts

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Assy Fe

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Technical Specifications

Multiplexer & Demultiplexer SN74LS258N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.175 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74LS258N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-066-8119, 5962010668119

NIIN

010668119

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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