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74AUP1G19GW,125

NXP Semiconductors

74AUP1G19GW,125 by NXP Semiconductors

NXP Semiconductors' 74AUP1G19GW,125 is a CMOS multiplexer with 21.7 ns propagation delay and 1.7 Amp max I (ol). It operates at -40 to 125 °C and has a package size of 2x1.25 mm, making it ideal for automotive applications requiring fast switching speeds in compact spaces.

Median Price

$0.136

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 3,000 parts In-Stock

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$0.160

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$0.076

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$0.069

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$0.058

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$0.160

$0.076

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Avnet

USA . 12,000 parts In-Stock

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$0.148

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Farnell

UK . 9,000 parts In-Stock

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EBV Elektronik

Germany . 9,000 parts In-Stock

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Future Electronics

Canada . 6,000 parts In-Stock

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Rochester

USA . 3,200 parts In-Stock

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$0.141

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Verical

USA . 3,200 parts In-Stock

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Digiode

USA . 2,241 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

USA . 177,000 parts In-Stock

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NAC Semi

USA . 18,000 parts In-Stock

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IBS Electronics

USA . 12,000 parts In-Stock

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Vyrian

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Anansix

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VNN

France . 1,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Semicontronic

India . 10,392 parts In-Stock

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$0.045

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Ampacity Inc.

Singapore . 9,209 parts In-Stock

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Corphita

USA . 3,726 parts In-Stock

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AZTECH Wire

Italy . 3,610 parts In-Stock

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Argo Parts USA

USA . 2,604 parts In-Stock

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Advanced Electronics

New Zealand . 270 parts In-Stock

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Aztec Data Supply Inc.

USA . 254 parts In-Stock

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$24.980

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Corohmni

South Africa . 897 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Authorized Procurement Solutions

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UNI Independent Distributors

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Continental Prestige Electronics

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Supply Digital

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Lucentia Tech

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Discover the innovative 74AUP1G19GW,125 by NXP Semiconductors, a high-quality multiplexer & demultiplexer designed to enhance your electronic projects. With a compact design and a wide range of applications, this product offers unparalleled performance and reliability. Benefit from its low propagation delay, dual terminal position, and complementary output polarity for seamless integration. Trust in NXP Semiconductors' expertise in semiconductor technology and elevate your projects to the next level with the 74AUP1G19GW,125.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 21.7 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 1.1

The low supply voltage requirement makes this product energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 30 pF

The specified load capacitance ensures compatibility with a wide range of electronic devices and circuits.

Power Supplies (V): 1.2/3.3

Support for multiple power supply options provides flexibility and compatibility with different systems.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G19GW,125 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.7 ns

Propagation Delay (tpd):

21.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AUP1G19GW,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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