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74AUP1G157GF-G

NXP Semiconductors

74AUP1G157GF-G by NXP Semiconductors

74AUP1G157GF-G by NXP Semiconductors is a compact CMOS multiplexer with a propagation delay of just 21.9 ns and operates at power supplies of 1.2/3.3V. It features dual inputs, a load capacitance of 30 pF, and is ideal for automotive applications. Its small outline package ensures efficient surface mounting in space-constrained designs.

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3

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1k+

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Anansix

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Native Components

USA . 557 parts In-Stock

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One Stop Electronics

USA . 262 parts In-Stock

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Corphita

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Northwest PG Solutions

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Overview

Unlock unparalleled performance and reliability with the 74AUP1G157GF-G from NXP Semiconductors. This high-quality multiplexer delivers exceptional speed and low power consumption, making it ideal for automotive and industrial applications. With its compact design and robust temperature range, you can trust this device to enhance your projects while ensuring efficiency and longevity. Elevate your designs and achieve remarkable results with NXP's trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures robustness and durability, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 21.9 ns

With a low propagation delay, this multiplexer and demultiplexer offers fast signal switching, enhancing overall system performance.

Surface Mount: YES

Surface mount capability allows for more efficient use of PCB space and simplifies assembly processes.

No. of Inputs: 2

Having two inputs provides flexibility for applications requiring basic multiplexing or demultiplexing, making it versatile for various designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB while facilitating easier integration into different system layouts.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF ensures minimal impact on circuit performance, allowing for efficient signal transmission.

Power Supplies (V): 1.2/3.3

Supports both low and standard voltage levels, providing design flexibility for diverse applications in automotive and consumer electronics.

No. of Terminals: 6

With six terminals, this device offers enough connectivity for a variety of circuit designs without unnecessary complexity.

Package Style (Meter): SMALL OUTLINE

The small outline design makes it ideal for compact applications where space is at a premium.

Maximum I (ol): 1.7 Amp

A high current handling capability of 1.7 Amps allows this product to be used in high-power applications, enhancing its usability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this device is suitable for demanding environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures ensures reliability in harsh conditions, which is crucial for automotive and industrial applications.

Terminal Position: DUAL

Dual terminal positioning aids in simplifying circuit design and layout, improving overall manufacturability.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this component ensures reliability and withstands the rigorous performance requirements of automotive applications.

Technology: CMOS

Utilizing CMOS technology contributes to low power consumption and high efficiency, ideal for battery-powered devices and portable applications.

Terminal Form: NO LEAD

No-lead terminals enhance soldering efficiency and reduce the risk of damage during assembly, while also meeting environmental standards.

Packing Method: TR

The TR packing method ensures efficient handling and reduces waste in manufacturing processes, promoting sustainability.

Terminal Pitch: 0.35 mm

A terminal pitch of 0.35 mm allows for compact designs and higher density circuit layouts, making it suitable for modern electronic devices.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GF-G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.9 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trade Compliance

74AUP1G157GF-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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