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74AUP1G157GF,132

NXP Semiconductors

74AUP1G157GF,132 by NXP Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VQCCN; Package Shape: SQUARE;

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 88,235 parts In-Stock

1+ parts

-

100+ parts

$0.348

1k+ parts

$0.289

10k+ parts

$0.257

88,235

-

$0.348

$0.289

$0.257

DigiKey

USA . 88,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.430

10k+ parts

-

88,235

-

-

$0.430

-

Verical

USA . 88,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.391

10k+ parts

$0.322

88,235

-

-

$0.391

$0.322

Farnell

UK . 15,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.149

15,300

-

-

-

$0.149

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 474 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

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474

$0.139

-

-

-

Chip Stock

USA . 183,000 parts In-Stock

1+ parts

-

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183,000

-

-

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DigiKey Marketplace

USA . 15,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.150

10k+ parts

-

15,300

-

-

$0.150

-

Vyrian

USA . 8,341 parts In-Stock

1+ parts

-

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8,341

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-

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Anansix

USA . 2,300 parts In-Stock

1+ parts

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2,300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 912 parts In-Stock

1+ parts

$0.131

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$0.131

-

-

-

Component Stockers USA

USA . 9,724 parts In-Stock

1+ parts

$0.150

100+ parts

$0.140

1k+ parts

$0.130

10k+ parts

$0.130

9,724

$0.150

$0.140

$0.130

$0.130

AZTECH Wire

Italy . 3,884 parts In-Stock

1+ parts

$0.180

100+ parts

-

1k+ parts

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10k+ parts

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3,884

$0.180

-

-

-

Microchip USA

USA . 940 parts In-Stock

1+ parts

$0.975

100+ parts

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1k+ parts

-

10k+ parts

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940

$0.975

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-

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Native Components

USA . 1,325 parts In-Stock

1+ parts

$6.370

100+ parts

-

1k+ parts

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10k+ parts

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1,325

$6.370

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Continental Prestige Electronics

USA . 88,235 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.175

10k+ parts

-

88,235

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-

$0.175

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UNI Independent Distributors

Spain . 4,356 parts In-Stock

1+ parts

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4,356

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Northwest PG Solutions

USA . 2,532 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.929

10k+ parts

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2,532

-

-

$5.929

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Supply Digital

USA . 315 parts In-Stock

1+ parts

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100+ parts

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315

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Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GF,132 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-PQCC-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.9 ns

Propagation Delay (tpd):

21.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1G157GF,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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