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74AUP1G157GM-G

NXP Semiconductors

74AUP1G157GM-G by NXP Semiconductors

74AUP1G157GM-G by NXP is a CMOS multiplexer with a propagation delay of 21.9 ns and operates at power supplies of 1.2/3.3V. It features dual inputs, a load capacitance of 30 pF, and is suitable for automotive applications in harsh environments. Its compact design ensures efficient surface mounting.

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3

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1k+

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Digiode

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One Stop Electronics

USA . 943 parts In-Stock

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UNI Independent Distributors

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Corphita

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Northwest PG Solutions

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Overview

Unlock exceptional performance with the 74AUP1G157GM-G multiplexer from NXP Semiconductors, a trusted leader in innovative semiconductor solutions. Designed for versatility, this compact, automotive-grade component excels in applications requiring efficient data routing and low power consumption. With robust reliability and a fast propagation delay, it empowers your designs to achieve superior functionality while fostering energy savings. Elevate your projects with NXP's commitment to quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and robustness in automotive applications.

Propagation Delay At Nominal Supply: 21.9 ns

A low propagation delay allows for faster signal transmission, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Surface mount technology leads to a smaller footprint on PCBs, enabling more compact designs in automotive systems.

No. of Inputs: 2

Having two inputs is versatile for many applications, providing flexibility in design and implementation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on the PCB.

Load Capacitance (CL): 30 pF

A low load capacitance increases switching speed and reduces power consumption, making it efficient for high-frequency applications.

Power Supplies (V): 1.2/3.3

Dual power supply options offer flexibility in system design and compatibility with various electronic components.

No. of Terminals: 6

The six terminals provide multiple connection options, enhancing the product's versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design, which is particularly beneficial in space-constrained automotive applications.

Maximum I (ol): 1.7 Amp

A high maximum output current allows for robust performance in driving loads, making it reliable for high-current applications.

Maximum Operating Temperature: 125 °C

Designed to withstand high temperatures, this product is suitable for demanding automotive environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability and functionality in extreme conditions typical in automotive applications.

Terminal Position: DUAL

Dual terminal positions provide ease of connection and enhance integration into various circuit designs.

Temperature Grade: AUTOMOTIVE

Being grade-qualified for automotive use indicates that it meets stringent industry standards for durability and performance.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, making this product ideal for modern automotive applications.

Terminal Form: NO LEAD

No lead terminals promote a cleaner design and can reduce the risk of shorts, contributing to long-term reliability.

Packing Method: TR

Tape and reel packing makes the product easy to handle and suitable for automated assembly processes.

Terminal Pitch: 0.5 mm

A small terminal pitch facilitates compact designs while maintaining good electrical performance, ideal for high-density circuits.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GM-G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.9 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

74AUP1G157GM-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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