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74AUP1G157GM,132

NXP Semiconductors

74AUP1G157GM,132 by NXP Semiconductors

MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

Median Price

$0.429

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,387,562 parts In-Stock

1+ parts

-

100+ parts

$0.421

1k+ parts

$0.349

10k+ parts

$0.312

2,387,562

-

$0.421

$0.349

$0.312

DigiKey

USA . 2,387,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.530

10k+ parts

-

2,387,562

-

-

$0.530

-

Verical

USA . 2,385,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.437

10k+ parts

$0.390

2,385,000

-

-

$0.437

$0.390

Farnell

UK . 23,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.149

23,970

-

-

-

$0.149

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,291 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

-

4,291

$0.151

-

-

-

Chip Stock

USA . 103,000 parts In-Stock

1+ parts

-

100+ parts

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103,000

-

-

-

-

Vyrian

USA . 8,143 parts In-Stock

1+ parts

-

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-

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-

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8,143

-

-

-

-

Anansix

USA . 2,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 806,626 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

-

10k+ parts

-

806,626

$0.127

-

-

-

Corphita

USA . 1,271 parts In-Stock

1+ parts

$0.143

100+ parts

-

1k+ parts

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10k+ parts

-

1,271

$0.143

-

-

-

AZTECH Wire

Italy . 4,301 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

-

4,301

$0.170

-

-

-

Northwest PG Solutions

USA . 1,160 parts In-Stock

1+ parts

$2.299

100+ parts

-

1k+ parts

-

10k+ parts

-

1,160

$2.299

-

-

-

Native Components

USA . 806 parts In-Stock

1+ parts

$952.676

100+ parts

$933.622

1k+ parts

$924.096

10k+ parts

$914.569

806

$952.676

$933.622

$924.096

$914.569

UNI Independent Distributors

Spain . 7,224 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,224

-

-

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Continental Prestige Electronics

USA . 2,562 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.186

10k+ parts

-

2,562

-

-

$0.186

-

Supply Digital

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,920

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Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GM,132 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.9 ns

Propagation Delay (tpd):

21.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1G157GM,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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