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74AUP1G157GW-G

NXP Semiconductors

74AUP1G157GW-G by NXP Semiconductors

74AUP1G157GW-G by NXP Semiconductors is a CMOS multiplexer with a propagation delay of 21.9 ns and operates b/w 1.2V to 3.3V. It features a compact design with 6 terminals and supports automotive applications in extreme temperatures from -40 °C to 125 °C. Ideal for space-constrained environments, it offers low load capacitance at 30 pF.

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3

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1k+

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Vyrian

USA . 876 parts In-Stock

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Anansix

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Digiode

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One Stop Electronics

USA . 1,238 parts In-Stock

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Native Components

USA . 867 parts In-Stock

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Northwest PG Solutions

USA . 875 parts In-Stock

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Corphita

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UNI Independent Distributors

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Overview

Unlock the potential of your designs with the 74AUP1G157GW-G from NXP Semiconductors—a trusted name in innovation. This high-quality multiplexer delivers exceptional performance and reliability, perfect for automotive applications where precision is crucial. With its compact design and low power consumption, it seamlessly integrates into your projects, enhancing efficiency while reducing space. Elevate your engineering solutions with NXP’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers excellent durability and thermal resistance, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 21.9 ns

A low propagation delay enhances the speed of signal processing, making this multiplexer/demultiplexer ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and increases assembly efficiency, which is essential in modern electronics.

No. of Inputs: 2

Having 2 inputs means versatility for basic applications, allowing for simple control and data management in electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization on PCBs, optimizing layout and design.

Load Capacitance (CL): 30 pF

A load capacitance of 30 pF ensures compatibility with various circuits while maintaining signal integrity.

Power Supplies (V): 1.2/3.3

Dual power supply options of 1.2V and 3.3V increase flexibility in system design, accommodating a range of operating conditions.

No. of Terminals: 6

The six terminals provide ample connectivity options, integrating well into diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design make this product ideal for compact devices where space is at a premium.

Maximum I (ol): 1.7 Amp

A maximum output current of 1.7 Amp allows for handling larger loads, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes the product reliable in harsh environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme conditions, enhancing its application range.

Terminal Position: DUAL

Dual terminal position facilitates straightforward PCB layout and soldering, simplifying assembly processes.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade specifications, this multiplexer/demultiplexer ensures reliability in critical automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a reliable choice for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and ease of handling during manufacturing.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated assembly, reducing production costs.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables compatibility with high-density packaging, enhancing design flexibility.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GW-G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.9 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74AUP1G157GW-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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