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SN54AS151J

Texas Instruments

SN54AS151J by Texas Instruments

The Texas Instruments SN54AS151J is an 8-input TTL multiplexer in a ceramic rectangular package with 16 terminals. Operating temperature range from -55°C to 125°C makes it suitable for military-grade applications. With through-hole terminal form and 2.54mm pitch, it offers reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,114 parts In-Stock

1+ parts

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6,114

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Digiode

USA . 3,062 parts In-Stock

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3,062

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$14.887

100+ parts

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641

$14.887

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Parana Technologies

USA . 1,447 parts In-Stock

1+ parts

$21.882

100+ parts

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1k+ parts

$22.372

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1,447

$21.882

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$22.372

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

$24.094

100+ parts

$22.167

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682

$24.094

$22.167

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ChromeModa Solutions

Germany . 1,056 parts In-Stock

1+ parts

$24.586

100+ parts

$20.161

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1,056

$24.586

$20.161

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IDEA Electronic Components Group

UK . 448 parts In-Stock

1+ parts

$24.586

100+ parts

$23.357

1k+ parts

$22.127

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448

$24.586

$23.357

$22.127

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One Stop Electronics

USA . 840 parts In-Stock

1+ parts

$58.000

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840

$58.000

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Corphita

USA . 2,569 parts In-Stock

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2,569

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Overview

Upgrade your electronic projects with the SN54AS151J by Texas Instruments, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Manufactured by the trusted name in the industry, this versatile component is perfect for a wide range of applications. With its durable ceramic package body and military-grade temperature grade, this product ensures long-lasting functionality even in challenging environments. Trust Texas Instruments to deliver top-notch technology and maximize the potential of your designs with the SN54AS151J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material offers excellent thermal conductivity and stability, making it ideal for high temperature applications.

No. of Inputs: 8

Having 8 inputs allows for greater flexibility and capability in handling multiple input signals.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into circuit designs and PCB layouts.

No. of Terminals: 16

With 16 terminals, this multiplexer/demultiplexer provides ample connectivity options for various devices and components.

Package Style (Meter): IN-LINE

In-line package style saves space and simplifies the assembly process in a circuit or system.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal position enhances connectivity and signal transmission capabilities for better performance.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure durability and reliability in demanding applications and environments.

Technology: TTL

TTL technology offers fast response times and low power consumption, ideal for high-speed data processing applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections for long-lasting performance.

Terminal Pitch: 2.54 mm

Standard 2.54 mm terminal pitch allows for easy integration with other components and PCBs.

Technical Specifications

Multiplexer & Demultiplexer SN54AS151J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN54AS151J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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