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SN54ALS157FK

Texas Instruments

SN54ALS157FK by Texas Instruments

SN54ALS157FK by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 28 ns at 5V, making it suitable for military-grade applications. With a max operating temperature of 125°C and surface-mount capability, it offers high performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,257 parts In-Stock

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Digiode

USA . 1,080 parts In-Stock

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1,080

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Distributors (Availability)

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AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$9.595

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851

$9.595

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Parana Technologies

USA . 447 parts In-Stock

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$19.629

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-

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$19.624

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447

$19.629

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$19.624

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DigiPath Technology Company

USA . 728 parts In-Stock

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$21.614

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728

$21.614

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ChromeModa Solutions

Germany . 282 parts In-Stock

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$22.055

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$18.085

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282

$22.055

$18.085

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IDEA Electronic Components Group

UK . 166 parts In-Stock

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$22.055

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$20.952

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$19.850

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166

$22.055

$20.952

$19.850

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One Stop Electronics

USA . 597 parts In-Stock

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$48.000

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597

$48.000

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Corphita

USA . 4,784 parts In-Stock

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Overview

Upgrade your electronic projects with the SN54ALS157FK by Texas Instruments, a high-quality multiplexer & demultiplexer chip designed to meet the demands of various applications. With a reliable manufacturer like Texas Instruments, you can trust in the superior performance and durability of this product. This versatile chip offers 4 functions, 2 inputs, and a fast propagation delay of just 28ns, making it ideal for a wide range of projects. Experience the value and benefits of this top-notch component in your next design.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high resistance to temperature changes, making the product durable and reliable in a variety of operating conditions.

Propagation Delay At Nominal Supply: 28 ns

Low propagation delay ensures fast data transmission, making this product suitable for applications that require quick response times.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

No. of Functions: 4

Having 4 functions in one device offers versatility and flexibility in designing complex electronic systems with multiple input/output requirements.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V simplifies power management and compatibility with other components in the system.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability even in demanding environments, making this product suitable for industrial and military applications.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of digital systems and provides reliable operation with fast switching characteristics.

Technical Specifications

Multiplexer & Demultiplexer SN54ALS157FK attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

11 mA

Propagation Delay At Nominal Supply:

28 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54ALS157FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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