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SN74F153DR

Texas Instruments

SN74F153DR by Texas Instruments

SN74F153DR by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions and 4 inputs. It has a propagation delay of 10.5 ns at nominal voltage of 5V, making it ideal for applications requiring fast switching b/w multiple input signals in commercial temperature environments.

Median Price

$0.344

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 2,215 parts In-Stock

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$0.580

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$0.320

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$0.277

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$0.253

2,215

$0.580

$0.320

$0.277

$0.253

Rochester

USA . 7,500 parts In-Stock

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-

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$0.307

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$0.255

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$0.227

7,500

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$0.307

$0.255

$0.227

DigiKey

USA . 7,500 parts In-Stock

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$0.380

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7,500

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$0.380

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Verical

USA . 2,500 parts In-Stock

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$0.284

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$0.284

Distributors (In-Stock)

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Digiode

USA . 4,044 parts In-Stock

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$0.189

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Vyrian

USA . 4,884 parts In-Stock

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Prism Electronics

USA . 2,471 parts In-Stock

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Resion

USA . 1,663 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,278 parts In-Stock

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ComSIT Distribution GmbH

Germany . 718 parts In-Stock

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Bristol Electronics

USA . 193 parts In-Stock

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$0.409

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$0.236

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193

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$0.236

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Dan-Mar Components

USA . 193 parts In-Stock

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193

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Nova Conductors

Japan . 34 parts In-Stock

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Semi Source

USA . 9 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,438 parts In-Stock

1+ parts

$0.169

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4,438

$0.169

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Corphita

USA . 3,694 parts In-Stock

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$0.179

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Microchip USA

USA . 1,641 parts In-Stock

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$1.455

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$1.455

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Corohmni

South Africa . 286 parts In-Stock

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$9.385

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286

$9.385

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Parana Technologies

USA . 873 parts In-Stock

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$14.734

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$15.173

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873

$14.734

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$15.173

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DigiPath Technology Company

USA . 2,339 parts In-Stock

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$16.224

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$14.926

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2,339

$16.224

$14.926

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ChromeModa Solutions

Germany . 4,183 parts In-Stock

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$16.555

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$13.575

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$16.555

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IDEA Electronic Components Group

UK . 1,237 parts In-Stock

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$16.555

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$15.727

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$14.900

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Perfect Parts

USA . 23,922 parts In-Stock

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Argo Parts USA

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Cyclops Electronics Ltd (Excess)

UK . 2,645 parts In-Stock

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Kepictronics

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Continental Prestige Electronics

USA . 1,560 parts In-Stock

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Glotronic Ltd.

UK . 540 parts In-Stock

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540

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A-Z Elektronik GmbH

Germany . 491 parts In-Stock

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491

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unparalleled quality and reliability of the SN74F153DR by Texas Instruments, a leading manufacturer in the industry. This multiplexer/demultiplexer offers exceptional performance in various applications, making it a versatile choice for your projects. With fast propagation delay and a durable package body material, this product ensures efficient operation and longevity. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs with precision and excellence. Elevate your designs with the value and benefits that the SN74F153DR provides, setting you apart from the rest. Choose innovation, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast switching times, making this multiplexer/demultiplexer suitable for high-speed data applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 4

Having 4 inputs provides flexibility in the number of signals that can be processed simultaneously, making the product versatile in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common power sources, making integration into existing systems easier.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connections, reducing the risk of signal loss or interference during operation.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions, increasing its reliability and usability in different settings.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL-based devices, simplifying integration into existing setups and improving overall system performance.

Technical Specifications

Multiplexer & Demultiplexer SN74F153DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74F153DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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