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DM54LS157J

Texas Instruments

DM54LS157J by Texas Instruments

The Texas Instruments DM54LS157J is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 21 ns at 5V, making it ideal for military-grade applications. With a max operating temperature of 125°C, this ceramic package device is suitable for demanding environments.

Median Price

$21.070

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 1 parts In-Stock

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$21.070

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Vyrian

USA . 7,309 parts In-Stock

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Anansix

USA . 2,803 parts In-Stock

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Digiode

USA . 1,540 parts In-Stock

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Zilex Electronics Inc.

Canada . 124 parts In-Stock

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Electronic Expediters

USA . 28 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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MISTER SPROCKETS

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Sinequanon

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North Shore Components

USA . 3 parts In-Stock

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DF Sales Co.

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LWI Electronics Inc

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Distributors (Availability)

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AZTECH Wire

Italy . 648 parts In-Stock

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$11.757

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One Stop Electronics

USA . 1,522 parts In-Stock

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$18.000

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Parana Technologies

USA . 493 parts In-Stock

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$21.617

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$23.803

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$21.899

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ChromeModa Solutions

Germany . 5,191 parts In-Stock

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$24.289

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IDEA Electronic Components Group

UK . 526 parts In-Stock

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$23.075

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$21.860

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Corphita

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Supply Digital

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Native Components

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Northwest PG Solutions

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Overview

Unleash the power of seamless data transmission with the DM54LS157J from Texas Instruments. Crafted with precision and quality in mind, this multiplexer & demultiplexer offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile component boasts 4 functions and 2 inputs, making it a must-have for any project. With a quick propagation delay of just 23ns, this product ensures fast and accurate signal processing. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs and unlock endless possibilities with the DM54LS157J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay allows for fast switching between input signals, making the product efficient in data transmission.

No. of Functions: 4

Having 4 functions in one device increases the versatility and flexibility of the product for different applications.

No. of Inputs: 2

Having 2 inputs allows for data selection and routing, which is essential in multiplexing and demultiplexing tasks.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and operation of the multiplexer/demultiplexer.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for demanding environments and industrial applications.

Technology: TTL

Being based on TTL technology ensures compatibility with other TTL devices and provides reliable logic signal processing.

Technical Specifications

Multiplexer & Demultiplexer DM54LS157J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.43 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

16 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DM54LS157J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-99-754-3759, 5962997543759, 5962-99-654-6073, 5962996546073

NIIN

997543759, 996546073

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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