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DM54LS157W

Texas Instruments

DM54LS157W by Texas Instruments

DM54LS157W by Texas Instruments is a TTL technology multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 23ns. Ideal for military-grade applications requiring high-speed data switching in a compact flatpack package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,741 parts In-Stock

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Digiode

USA . 1,394 parts In-Stock

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Anansix

USA . 962 parts In-Stock

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Electronic Expediters

USA . 90 parts In-Stock

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90

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Native Components

USA . 104 parts In-Stock

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$0.135

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$0.130

104

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Northwest PG Solutions

USA . 1,117 parts In-Stock

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$0.149

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$0.131

1,117

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$0.131

AZTECH Wire

Italy . 383 parts In-Stock

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$6.046

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383

$6.046

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One Stop Electronics

USA . 1,590 parts In-Stock

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$9.000

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1,590

$9.000

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Parana Technologies

USA . 274 parts In-Stock

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$9.676

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$10.262

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$9.676

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DigiPath Technology Company

USA . 702 parts In-Stock

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$10.655

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$9.802

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702

$10.655

$9.802

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ChromeModa Solutions

Germany . 4,710 parts In-Stock

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$10.872

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$8.915

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$10.872

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IDEA Electronic Components Group

UK . 51 parts In-Stock

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$10.872

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$10.328

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$9.785

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51

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Corphita

USA . 4,688 parts In-Stock

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Supply Digital

USA . 550 parts In-Stock

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Overview

Enhance your electronic projects with the DM54LS157W by Texas Instruments, a top-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Manufactured with precision using ceramic and glass-sealed materials, this component is designed to excel in demanding military-grade applications. With 4 functions and 2 inputs, this versatile device provides seamless integration and efficient signal switching. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and benefits to customers looking for high-quality components for their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Offers versatility and flexibility in signal routing and management, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power sources, ensuring seamless integration into existing systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding environments.

Technical Specifications

Multiplexer & Demultiplexer DM54LS157W attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

23 ns

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

DM54LS157W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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