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DM74LS157N/B+

Texas Instruments

DM74LS157N/B+ by Texas Instruments

DM74LS157N/B+ by Texas Instruments is a TTL multiplexer with 4 functions, 2 inputs, and 30 ns propagation delay. It operates at a nominal voltage of 5V and has a max power supply current of 16mA. This IC is commonly used in commercial applications requiring signal routing and data selection.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,962 parts In-Stock

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Vyrian

USA . 3,186 parts In-Stock

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Anansix

USA . 747 parts In-Stock

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AZTECH Wire

Italy . 850 parts In-Stock

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$11.025

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850

$11.025

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One Stop Electronics

USA . 1,592 parts In-Stock

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$20.000

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Native Components

USA . 267 parts In-Stock

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$25.282

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Parana Technologies

USA . 1,940 parts In-Stock

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$25.780

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$26.385

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$25.780

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Northwest PG Solutions

USA . 1,775 parts In-Stock

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$27.810

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$25.029

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$27.810

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ChromeModa Solutions

Germany . 2,427 parts In-Stock

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$28.966

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$23.752

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IDEA Electronic Components Group

UK . 1,381 parts In-Stock

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$28.966

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$27.518

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$26.069

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Corphita

USA . 3,639 parts In-Stock

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DigiPath Technology Company

USA . 720 parts In-Stock

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$26.116

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Overview

Experience the superior quality and reliability of Texas Instruments with the DM74LS157N/B+ multiplexer & demultiplexer. This versatile component offers 4 functions and 2 inputs, making it perfect for a wide range of applications. With a propagation delay of only 30 ns and maximum power supply current of 16 mA, this product provides efficient performance while maintaining a nominal supply voltage of 5V. Trust in Texas Instruments for cutting-edge technology and unparalleled value in your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast and efficient data transfer within the device.

No. of Functions: 4

The multiple functions allow for versatile usage and capability in handling different inputs and outputs.

No. of Inputs: 2

Having 2 inputs provides flexibility in connecting various input sources to the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and readily available for powering the device.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, this product can be used in various environmental conditions without overheating.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices and maintains signal integrity.

Technical Specifications

Multiplexer & Demultiplexer DM74LS157N/B+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

16 mA

Propagation Delay At Nominal Supply:

30 ns

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM74LS157N/B+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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