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DM74LS158N

Texas Instruments

DM74LS158N by Texas Instruments

DM74LS158N by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It operates at a supply voltage range of 4.75V to 5.25V, with a propagation delay of 21ns. This IC is commonly used in commercial applications requiring signal routing and data selection tasks due to its inverted output polarity and through-hole terminal form.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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Rochester

USA . 20 parts In-Stock

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Freelance Electronics

USA . 328 parts In-Stock

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Digiode

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American Microsemiconductor Inc.

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Vyrian

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Mentor Electronics Marketing, LLC

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PC Components Company LLC

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Digital Electronic Gebert Verwaltungs UG

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Native Components

USA . 621 parts In-Stock

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$0.141

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Northwest PG Solutions

USA . 1,038 parts In-Stock

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Corphita

USA . 2,521 parts In-Stock

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Parana Technologies

USA . 778 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 2,434 parts In-Stock

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IDEA Electronic Components Group

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Microchip USA

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Infinite Electronics LLP (Excess)

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Metaverse IC Inc.

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GreenTree Electronics

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Overview

Elevate your electronic projects with the DM74LS158N by Texas Instruments. This multiplexer & demultiplexer boasts high-quality construction and reliability, thanks to its renowned manufacturer. With 4 functions and 2 inputs, this versatile component offers seamless integration into a variety of applications. Experience efficient signal routing and data management with this compact, rectangular package that operates at a nominal supply voltage of 5V. Trust in Texas Instruments for cutting-edge technology that delivers exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan.

No. of Functions: 4

Having 4 functions allows for more versatile signal processing and routing capabilities, making this product suitable for complex applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with a wide range of systems and ensures reliable performance.

Propagation Delay (tpd): 21 ns

Low propagation delay of 21ns ensures fast and efficient signal processing, making this product ideal for time-sensitive applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without sacrificing performance.

Technology: TTL

Using TTL technology ensures compatibility with a variety of TTL-based systems, making integration easier and more seamless.

Technical Specifications

Multiplexer & Demultiplexer DM74LS158N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

21 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DM74LS158N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-247-5615, 5962012475615

NIIN

012475615

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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