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CD74HCT158EE4

Texas Instruments

CD74HCT158EE4 by Texas Instruments

CD74HCT158EE4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It operates at a supply voltage of 5V, has a propagation delay of 40ns, and can handle load capacitance up to 50pF. This rectangular package is ideal for military-grade applications requiring fast signal switching.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,479 parts In-Stock

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Digiode

USA . 1,460 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 252 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 896 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Parana Technologies

USA . 695 parts In-Stock

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DigiPath Technology Company

USA . 1,347 parts In-Stock

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$30.527

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ChromeModa Solutions

Germany . 6,126 parts In-Stock

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IDEA Electronic Components Group

UK . 363 parts In-Stock

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$28.035

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One Stop Electronics

USA . 349 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Overview

Enhance your electronic projects with the CD74HCT158EE4 by Texas Instruments, a top-tier manufacturer known for delivering premium quality components. This multiplexer and demultiplexer offers exceptional performance, reliability, and efficiency, making it ideal for a wide range of applications. With its innovative design and advanced technology, this product ensures seamless operation and precise results. Trust Texas Instruments to provide you with cutting-edge solutions that elevate your projects to new heights. Upgrade your electronics with the CD74HCT158EE4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components.

Propagation Delay At Nominal Supply: 40 ns

Ensures fast and efficient signal processing.

No. of Functions: 4

Allows for multiple functions to be performed simultaneously.

No. of Inputs: 2

Offers flexibility in input configurations.

Package Shape: RECTANGULAR

Facilitates easy integration into existing systems.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supplies.

Load Capacitance (CL): 50 pF

Helps in reducing noise and maintaining signal integrity.

Power Supplies (V): 5

Provides consistent power delivery.

No. of Terminals: 16

Allows for easy connection to other components.

Package Style (Meter): IN-LINE

Space-saving design for efficient PCB layout.

Maximum I (ol): 4 Amp

Can handle high current loads without issue.

Propagation Delay (tpd): 210 ns

Balances speed and performance for optimal operation.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without malfunctioning.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments without issue.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable connections.

Terminal Position: DUAL

Facilitates easy installation and connection.

Maximum Seated Height: 5.08 mm

Compact design for space-constrained applications.

Width: 7.62 mm

Compact size for efficient PCB layout.

Output Polarity: INVERTED

Configurable output polarity for versatile usage.

Minimum Supply Voltage (Vsup): 4.5 V

Wide operating voltage range for flexibility.

Length: 19.305 mm

Compact size for space-efficient integration.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance.

Technology: CMOS

Low power consumption and fast switching speeds.

Terminal Form: THROUGH-HOLE

Easy soldering and robust connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a margin of safety against voltage fluctuations.

Technical Specifications

Multiplexer & Demultiplexer CD74HCT158EE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HCT158EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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