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SN74LVC157PW

Texas Instruments

SN74LVC157PW by Texas Instruments

SN74LVC157PW by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage range of 2.7V to 3.6V. It features CMOS technology, industrial temperature grade, and a small outline package style for space-constrained applications in various industries. With surface mount capability and true output polarity, it is ideal for compact electronic designs requiring signal routing and selection functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,546 parts In-Stock

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Vyrian

USA . 2,863 parts In-Stock

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Semi Source

USA . 31 parts In-Stock

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Prism Electronics

USA . 23 parts In-Stock

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One Stop Electronics

USA . 916 parts In-Stock

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$9.000

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916

$9.000

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AZTECH Wire

Italy . 354 parts In-Stock

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$14.793

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354

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Parana Technologies

USA . 1,910 parts In-Stock

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$21.656

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$2,011.122

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$19.491

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$21.656

$2,011.122

$19.491

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DigiPath Technology Company

USA . 2,265 parts In-Stock

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$23.846

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$21.939

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$23.846

$21.939

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ChromeModa Solutions

Germany . 4,546 parts In-Stock

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$24.333

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$19.953

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$24.333

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IDEA Electronic Components Group

UK . 363 parts In-Stock

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$24.333

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$23.116

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$21.900

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363

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Corphita

USA . 4,423 parts In-Stock

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Perfect Parts

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Overview

Discover the cutting-edge SN74LVC157PW by Texas Instruments, a top-notch Multiplexer & Demultiplexer that offers unparalleled quality and reliability. Designed with precision using advanced CMOS technology, this compact device packs a powerful punch with 4 functions and 2 inputs. Perfect for industrial applications, the SN74LVC157PW operates flawlessly in temperatures ranging from -40 to 85°C. With its true output polarity and low supply voltage requirements, this product delivers exceptional performance at an unbeatable value, making it the ideal choice for all your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to damage during transportation or installation.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of devices and applications.

No. of Terminals: 16

With a high number of terminals, it provides flexibility in connecting to other components or peripherals, allowing for versatile integration in electronic circuits.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, improving energy efficiency and signal integrity in the circuit.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC157PW attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SN74LVC157PW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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