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74HC151PW-Q100,118

NXP Semiconductors

74HC151PW-Q100,118 by NXP Semiconductors

NXP Semiconductors' 74HC151PW-Q100,118 is an AEC-Q100 rated multiplexer with 8 inputs and 16 terminals. It operates at a nominal voltage of 5V, has a propagation delay of 56ns, and can handle load capacitance of 50pF. Ideal for automotive applications due to its CMOS technology and wide temperature range from -40°C to 125°C.

Median Price

$0.186

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 3,580 parts In-Stock

1+ parts

$0.430

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$0.231

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$0.196

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$0.178

3,580

$0.430

$0.231

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$0.178

Mouser Electronics

USA . 2,834 parts In-Stock

1+ parts

$0.460

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$0.232

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$0.213

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$0.166

2,834

$0.460

$0.232

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$0.166

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

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$0.186

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$0.155

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$0.138

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$0.186

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$0.138

Verical

USA . 2,500 parts In-Stock

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$0.172

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Farnell

UK . 225 parts In-Stock

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Digiode

USA . 647 parts In-Stock

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$0.153

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Nova Conductors

Japan . 900 parts In-Stock

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Chip Stock

USA . 116,000 parts In-Stock

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Vyrian

USA . 7,423 parts In-Stock

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Anansix

USA . 2,018 parts In-Stock

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VNN

France . 99 parts In-Stock

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Ampacity Inc.

Singapore . 6,326 parts In-Stock

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$0.137

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Semicontronic

India . 6,236 parts In-Stock

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$0.137

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$0.134

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$0.133

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Corphita

USA . 3,546 parts In-Stock

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$0.145

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Component Stockers USA

USA . 21,196 parts In-Stock

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$0.150

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$0.140

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$0.230

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$0.180

21,196

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$0.140

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$0.180

AZTECH Wire

Italy . 7,639 parts In-Stock

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$0.190

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Argo Parts USA

USA . 4,620 parts In-Stock

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$0.288

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$0.279

4,620

$0.288

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$0.279

Aztec Data Supply Inc.

USA . 74 parts In-Stock

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$0.300

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74

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Corohmni

South Africa . 242 parts In-Stock

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$0.309

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QUARKTWIN TECHNOLOGY LTD

USA . 6,959 parts In-Stock

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UNI Independent Distributors

Spain . 6,730 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Continental Prestige Electronics

USA . 225 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unleash the power of high-quality signal routing with the 74HC151PW-Q100,118 by NXP Semiconductors. Designed for automotive applications, this multiplexer & demultiplexer offers reliable performance and efficient signal processing. With a compact design and a wide range of operating temperatures, this product is built to withstand challenging conditions while delivering exceptional results. Upgrade your projects with the cutting-edge technology of NXP Semiconductors and experience unparalleled value and reliability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the package lightweight and durable, suitable for automotive applications.

Propagation Delay At Nominal Supply: 56 ns

The low propagation delay ensures fast data transmission, making this product efficient for multiplexing and demultiplexing signals.

Surface Mount: YES

Being surface mountable simplifies the manufacturing process and allows for compact PCB designs.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures reliability and quality for automotive electronics applications.

No. of Inputs: 8

8 inputs provide sufficient channels for multiplexing multiple signals into one output, or vice versa.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is common and easily compatible with other electronic components.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal signal distortion during multiplexing and demultiplexing operations.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V offers flexibility in different circuit configurations.

No. of Terminals: 16

Having 16 terminals allows for easy interfacing with other components and PCB layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and enables high-density integration.

Technical Specifications

Multiplexer & Demultiplexer 74HC151PW-Q100,118 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

56 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74HC151PW-Q100,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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