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CD74AC257M96

Texas Instruments

CD74AC257M96 by Texas Instruments

CD74AC257M96 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 13ns. It operates at a nominal voltage of 3.3V and has a load capacitance of 50pF. This CMOS technology device is ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

$1.050

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,932 parts In-Stock

1+ parts

$0.877

100+ parts

$0.675

1k+ parts

$0.355

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44,932

$0.877

$0.675

$0.355

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Mouser Electronics

USA . 3,967 parts In-Stock

1+ parts

$1.050

100+ parts

$0.603

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$0.544

10k+ parts

$0.489

3,967

$1.050

$0.603

$0.544

$0.489

DigiKey

USA . 2,446 parts In-Stock

1+ parts

$1.050

100+ parts

$0.603

1k+ parts

$0.543

10k+ parts

$0.484

2,446

$1.050

$0.603

$0.543

$0.484

Distributors (In-Stock)

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Digiode

USA . 2,063 parts In-Stock

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$0.833

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2,063

$0.833

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Vyrian

USA . 1,394 parts In-Stock

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$0.877

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1,394

$0.877

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Component Sense

UK . 2,846 parts In-Stock

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Speed Components Ltd

Israel . 1,882 parts In-Stock

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Inventory MP

USA . 1,108 parts In-Stock

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Bristol Electronics

USA . 1,108 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 200 parts In-Stock

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200

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Native Components

USA . 381 parts In-Stock

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$0.284

100+ parts

-

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-

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$0.273

381

$0.284

-

-

$0.273

Northwest PG Solutions

USA . 630 parts In-Stock

1+ parts

$0.312

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$0.275

630

$0.312

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$0.275

Corphita

USA . 1,174 parts In-Stock

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$0.789

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$0.789

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Parana Technologies

USA . 1,968 parts In-Stock

1+ parts

$25.084

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$25.764

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1,968

$25.084

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$25.764

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ChromeModa Solutions

Germany . 4,151 parts In-Stock

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$28.184

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$23.111

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$28.184

$23.111

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

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$28.184

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$26.775

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$25.366

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1,511

$28.184

$26.775

$25.366

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QUARKTWIN TECHNOLOGY LTD

USA . 12,212 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 4,628 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,085 parts In-Stock

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 2,029 parts In-Stock

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$25.411

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Lixinc

USA . 1,548 parts In-Stock

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Supply Digital

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Overview

Looking for a reliable and versatile multiplexer/demultiplexer? Look no further than the Texas Instruments CD74AC257M96! With a reputation for high-quality products, Texas Instruments delivers exceptional performance in a compact package. Ideal for a wide range of applications, this product offers customers value and benefits, providing seamless integration and efficient operation. Trust Texas Instruments to meet your needs with the CD74AC257M96!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 13 ns

Low propagation delay ensures fast data transmission, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Provides versatility by allowing the device to perform multiple functions within a circuit.

No. of Inputs: 2

Suitable for applications requiring input from multiple sources, increasing flexibility in circuit design.

Package Shape: RECTANGULAR

Standard package shape that is easy to handle and integrate into existing circuit layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it easy to integrate into various electronic systems.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a typical load capacitance, ensuring optimal performance.

Power Supplies (V): 3.3/5

Can be powered by multiple supply voltages, providing flexibility in different circuit configurations.

No. of Terminals: 16

Provides multiple connection points for easy integration into complex circuit layouts.

Maximum I (ol): 24 Amp

High output current capability allows for driving multiple loads without external amplification.

Propagation Delay (tpd): 117 ns

Low propagation delay ensures fast data processing and minimal signal distortion.

Maximum Operating Temperature: 125 °C

Can operate in a wide range of temperatures, suitable for both commercial and industrial applications.

Output Characteristics: 3-STATE

Provides additional flexibility in controlling the output state of the device, enhancing its functionality.

Minimum Operating Temperature: -55 °C

Designed to operate in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable connections and prevents corrosion over time.

Terminal Position: DUAL

Dual terminal position allows for easy integration into circuit layouts with different connection orientations.

Maximum Seated Height: 1.75 mm

Low profile design saves space on circuit boards and allows for compact system designs.

Width: 3.9 mm

Compact width allows for easy integration into tight spaces within electronic systems.

Output Polarity: TRUE

Consistent output polarity ensures compatibility with other components in the circuit.

Minimum Supply Voltage (Vsup): 1.5 V

Can operate at low supply voltages, making it suitable for power-constrained applications.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes, ensuring reliability during manufacturing.

Length: 9.9 mm

Compact length makes it suitable for applications with limited space constraints.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, ensuring durability and reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering onto circuit boards, ensuring secure connections.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, saving time and labor costs.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into standard PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

Can safely operate at high supply voltages, providing flexibility in different power supply configurations.

Maximum Power Supply Current (ICC): 0.16 mA

Low power supply current consumption ensures energy efficiency and prolongs battery life in portable devices.

Technical Specifications

Multiplexer & Demultiplexer CD74AC257M96 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

117 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74AC257M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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