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FSAL200QSCX

Onsemi

FSAL200QSCX by Onsemi

FSAL200QSCX by Onsemi is a 4-function multiplexer/demultiplexer with 16 terminals. It operates at temperatures from -40 to 85°C, suitable for industrial use. With a supply voltage range of 3-5V and compact dimensions of 4.9mm x 3.9mm x 1.72mm, it's ideal for small electronic applications.

Median Price

$0.954

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$0.675

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-

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2

$0.675

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Rochester

USA . 116,174 parts In-Stock

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-

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$0.936

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$0.777

10k+ parts

$0.693

116,174

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$0.936

$0.777

$0.693

Verical

USA . 113,959 parts In-Stock

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-

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$0.972

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$0.866

113,959

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$0.972

$0.866

DigiKey

USA . 1,034 parts In-Stock

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$1.240

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Flip Electronics (Authorized)

USA . 1,034 parts In-Stock

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1,034

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Distributors (In-Stock)

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Digiode

USA . 1,389 parts In-Stock

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$0.641

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1,389

$0.641

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Nova Conductors

Japan . 50 parts In-Stock

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$0.845

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50

$0.845

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Freelance Electronics

USA . 444 parts In-Stock

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$1.762

100+ parts

$1.851

1k+ parts

$1.745

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444

$1.762

$1.851

$1.745

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Component Electronics Inc.

Canada . 2 parts In-Stock

1+ parts

$1.920

100+ parts

$1.440

1k+ parts

$1.250

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2

$1.920

$1.440

$1.250

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Vyrian

USA . 27,779 parts In-Stock

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Chip Stock

USA . 21,000 parts In-Stock

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Inventory MP

USA . 5,294 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 2,500 parts In-Stock

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Bristol Electronics

USA . 2,389 parts In-Stock

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2,389

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Flip Electronics

USA . 1,034 parts In-Stock

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1,034

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ACDS - Activité Composants Distribution Service

France . 995 parts In-Stock

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Dan-Mar Components

USA . 835 parts In-Stock

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835

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Sea View Technologies

USA . 605 parts In-Stock

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605

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Ashlea Components Ltd

UK . 293 parts In-Stock

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Prism Electronics

USA . 124 parts In-Stock

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NexGen Digital

USA . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 27,793 parts In-Stock

1+ parts

$0.570

100+ parts

$0.556

1k+ parts

$0.553

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27,793

$0.570

$0.556

$0.553

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Ampacity Inc.

Singapore . 27,553 parts In-Stock

1+ parts

$0.570

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$0.570

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Corphita

USA . 2,340 parts In-Stock

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$0.608

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2,340

$0.608

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Corohmni

South Africa . 206 parts In-Stock

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$0.675

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$0.675

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Microchip USA

USA . 280 parts In-Stock

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$4.622

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280

$4.622

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Aztec Data Supply Inc.

USA . 55 parts In-Stock

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$25.224

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55

$25.224

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Perfect Parts

USA . 61,921 parts In-Stock

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Problanco Electronics

Mexico . 8,144 parts In-Stock

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TANS Electronics

Latvia . 7,473 parts In-Stock

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Continental Prestige Electronics

USA . 6,560 parts In-Stock

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SupplyDigital Components

Austria . 5,805 parts In-Stock

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Kulean Microsystems

USA . 5,303 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,283 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,522 parts In-Stock

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3,522

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Kepictronics

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,480 parts In-Stock

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Authorized Procurement Solutions

USA . 2,380 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,125 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.828

1k+ parts

$0.802

10k+ parts

$0.785

2,000

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$0.828

$0.802

$0.785

Argo Parts USA

USA . 1,342 parts In-Stock

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1,342

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Supply Digital

USA . 778 parts In-Stock

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778

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the FSAL200QSCX by Onsemi. This multiplexer & demultiplexer offers unparalleled quality and reliability, backed by Onsemi's reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this versatile component provides 4 functions in a compact, durable package. Experience seamless integration and improved performance with a nominal supply voltage of 3.3V and dual terminal position design. Upgrade your projects today with the FSAL200QSCX and discover the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

This product is convenient for surface mounting, making it easy to integrate into various electronics systems.

No. of Functions: 4

With 4 functions in one device, this multiplexer/demultiplexer offers versatile functionality in a compact package.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this product is compatible with a wide range of electronics systems.

Power Supplies (V): 3.3/5

This product can be powered by either 3.3V or 5V supplies, providing flexibility in compatibility.

No. of Terminals: 16

With 16 terminals, this multiplexer/demultiplexer offers multiple connection points for versatile applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design of this package style save space in circuit layouts.

Maximum Operating Temperature: 85 °C

This product can operate efficiently at temperatures up to 85°C, ensuring reliable performance in various environments.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high impedance when the output is disabled, reducing interference in the system.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable connection while preventing corrosion.

Terminal Position: DUAL

The dual terminal position offers multiple options for connecting to other components in the circuit.

Maximum Seated Height: 1.72 mm

The low seated height of 1.72mm allows for a compact design and space-saving installation.

Width: 3.9 mm

The slim width of 3.9mm makes this product suitable for applications with limited space.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission in the circuit.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this product operates efficiently in low-power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures safe and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product withstands high-temperature soldering processes.

Length: 4.9 mm

The compact length of 4.9mm allows for easy integration into circuit layouts.

Temperature Grade: INDUSTRIAL

This product is designed for industrial applications, ensuring robust performance in demanding environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection while enabling easy soldering during assembly.

Packing Method: TR

The tape and reel packing method simplifies the handling and storage of this product during production.

Terminal Pitch: 0.635 mm

The terminal pitch of 0.635mm allows for easy connection to other components on the circuit board.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is suitable for reflow soldering without requiring special handling procedures.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can withstand higher voltage inputs for versatile applications.

Maximum Power Supply Current (ICC): 0.001 mA

The low power supply current of 0.001mA ensures efficient operation and minimal power consumption.

No. of Outputs: 2

With 2 outputs, this multiplexer/demultiplexer provides multiple signal routing options for enhanced functionality.

Technical Specifications

Multiplexer & Demultiplexer FSAL200QSCX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

FSA

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.001 mA

Qualification:

Not Qualified

Maximum Seated Height:

1.72 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FSAL200QSCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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