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DM74LS151J

Texas Instruments

DM74LS151J by Texas Instruments

The Texas Instruments DM74LS151J is an 8-input TTL multiplexer with a propagation delay of 35 ns. Operating b/w 0-70°C, it has a supply voltage range of 4.75-5.25V and comes in a rectangular plastic/epoxy package. Ideal for commercial applications requiring complementary output polarity in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,447 parts In-Stock

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Anansix

USA . 802 parts In-Stock

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802

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Electronic Expediters

USA . 483 parts In-Stock

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483

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Digiode

USA . 465 parts In-Stock

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465

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Pride Electronics

USA . 28 parts In-Stock

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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Northwest PG Solutions

USA . 1,730 parts In-Stock

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$3.416

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Parana Technologies

USA . 2,352 parts In-Stock

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$17.456

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$17.654

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DigiPath Technology Company

USA . 2,357 parts In-Stock

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$19.222

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$17.684

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AZTECH Wire

Italy . 300 parts In-Stock

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$19.237

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$19.237

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ChromeModa Solutions

Germany . 3,951 parts In-Stock

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$19.614

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$16.083

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

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$19.614

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$18.633

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$17.653

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One Stop Electronics

USA . 593 parts In-Stock

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$47.000

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Corphita

USA . 5,016 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Native Components

USA . 3 parts In-Stock

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$3.012

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Overview

Elevate your electronic projects with the DM74LS151J by Texas Instruments. Crafted with precision and reliability, this multiplexer & demultiplexer offers unmatched performance in a variety of applications. With its durable plastic/epoxy package body material and 8 inputs, this rectangular-shaped device delivers exceptional value and benefits to customers. Experience seamless integration with a nominal supply voltage of 5V and a propagation delay of just 35ns. Trust Texas Instruments for quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product, making it a suitable choice for long-term use.

No. of Inputs: 8

Having 8 inputs allows for versatile input options, making the product suitable for various applications that require multiple input signals to be processed.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common and easily available power source, ensuring compatibility with most electronic systems.

Propagation Delay (tpd): 35 ns

The low propagation delay of 35 ns ensures efficient signal processing and minimal lag time, making the product ideal for time-sensitive applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperatures without compromising its performance, making it suitable for use in various environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of devices and systems that support TTL logic, making the product versatile and easy to integrate into existing setups.

Technical Specifications

Multiplexer & Demultiplexer DM74LS151J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

35 ns

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

DM74LS151J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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