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DM74LS157J/A+

Texas Instruments

DM74LS157J/A+ by Texas Instruments

DM74LS157J/A+ by Texas Instruments is a TTL multiplexer with 4 functions, 2 inputs, and 30 ns propagation delay at 5V. It has a max operating temperature of 70°C and is ideal for commercial applications requiring high-speed signal switching in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,837 parts In-Stock

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Anansix

USA . 2,176 parts In-Stock

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Digiode

USA . 319 parts In-Stock

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AZTECH Wire

Italy . 878 parts In-Stock

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$11.350

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Parana Technologies

USA . 172 parts In-Stock

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$19.655

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$19.645

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DigiPath Technology Company

USA . 2,294 parts In-Stock

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$21.642

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$19.911

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ChromeModa Solutions

Germany . 3,210 parts In-Stock

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$22.084

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$18.109

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$22.084

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IDEA Electronic Components Group

UK . 1,308 parts In-Stock

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$22.084

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$20.980

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$19.876

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One Stop Electronics

USA . 1,327 parts In-Stock

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$50.000

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Northwest PG Solutions

USA . 2,200 parts In-Stock

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Corphita

USA . 1,376 parts In-Stock

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Native Components

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Overview

Elevate your circuit design with the DM74LS157J/A+ multiplexer by Texas Instruments, known for its unparalleled quality and reliability. This versatile component offers 4 functions with 2 inputs, making it ideal for a wide range of applications. With a fast propagation delay of just 30 ns and a low power supply current of 16 mA, this multiplexer delivers exceptional performance while maximizing efficiency. Trust in Texas Instruments to provide top-notch solutions for your electronic projects, ensuring seamless integration and superior results every time. Upgrade your designs today with the DM74LS157J/A+!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, making this product suitable for applications where temperature management is critical.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast processing of signals, making this product efficient for time-sensitive applications.

No. of Functions: 4

Having multiple functions in a single device saves space and reduces the need for additional components, making this product cost-effective.

No. of Inputs: 2

With multiple inputs, this multiplexer/demultiplexer allows for versatile signal routing and processing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is compatible with a wide range of electronic systems.

Maximum I (ol): 8 Amp

High output current capability allows this product to drive heavy loads, making it suitable for demanding applications.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, this product can function reliably in various environments.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic systems, enhancing the versatility of this product.

Technical Specifications

Multiplexer & Demultiplexer DM74LS157J/A+ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

16 mA

Propagation Delay At Nominal Supply:

30 ns

Sub-Category:

Multiplexer/Demultiplexers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM74LS157J/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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