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SN74HC356N

Texas Instruments

SN74HC356N by Texas Instruments

SN74HC356N by Texas Instruments is an 8-input multiplexer with a package style of IN-LINE and 20 terminals. It operates b/w -40°C to 85°C, featuring CMOS technology and 3-STATE output characteristics. Ideal for industrial applications requiring high temperature tolerance and versatile signal routing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,565 parts In-Stock

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4,565

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Digiode

USA . 2,018 parts In-Stock

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2,018

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 704 parts In-Stock

1+ parts

$6.000

100+ parts

-

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704

$6.000

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AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$8.283

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727

$8.283

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Parana Technologies

USA . 2,318 parts In-Stock

1+ parts

$19.684

100+ parts

$1,827.970

1k+ parts

$17.716

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2,318

$19.684

$1,827.970

$17.716

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$21.675

100+ parts

$19.941

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1,569

$21.675

$19.941

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

1+ parts

$22.117

100+ parts

$21.011

1k+ parts

$19.905

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1,315

$22.117

$21.011

$19.905

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ChromeModa Solutions

Germany . 926 parts In-Stock

1+ parts

$22.117

100+ parts

$18.136

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926

$22.117

$18.136

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Corphita

USA . 3,640 parts In-Stock

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3,640

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Overview

Unlock the power of seamless data transmission with the SN74HC356N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures unparalleled quality and reliability in its products. Designed as a multiplexer/demultiplexer, this versatile component offers immense value and benefits for a wide range of applications. With 8 inputs and advanced CMOS technology, the SN74HC356N guarantees smooth operation and efficient performance in industrial settings. Trust Texas Instruments to deliver cutting-edge solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product durable and resistant to external damages, ensuring a longer lifespan.

No. of Inputs: 8

Having 8 inputs allows for a wide range of input options, making the product versatile and suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration and installation in different electronic systems, saving space and enhancing compatibility.

Power Supplies (V): 2/6

Support for power supplies of 2V and 6V provides flexibility in voltage requirements, making the product adaptable to different power sources.

No. of Terminals: 20

The 20 terminals offer ample connectivity options, enabling seamless connections with other components and devices for efficient operation.

Package Style (Meter): IN-LINE

The in-line package style simplifies the integration process and enhances the product's overall appearance, making it visually appealing and easy to handle.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance in challenging conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high impedance states, enabling efficient signal routing and reducing power consumption when not in use.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures functionality in cold environments, making the product suitable for a wide range of operating conditions.

Terminal Position: DUAL

The dual terminal position offers redundancy in connectivity, enhancing reliability and reducing the risk of signal loss or interruption.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature requirements, the product is designed to withstand harsh industrial environments, ensuring consistent performance in demanding settings.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers strong mechanical support and easy soldering capabilities, ensuring secure connections and longevity of the product.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection with standard electronic components, enhancing compatibility and facilitating seamless integration within electronic systems.

Technical Specifications

Multiplexer & Demultiplexer SN74HC356N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74HC356N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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