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SN74F251BDRG4

Texas Instruments

SN74F251BDRG4 by Texas Instruments

SN74F251BDRG4 by Texas Instruments is an 8-input multiplexer with a propagation delay of 8 ns at 5V. It features a small outline package, operates b/w 0-70°C, and has a max supply voltage of 5.5V. Ideal for applications requiring high-speed signal switching in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,892 parts In-Stock

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Digiode

USA . 3,233 parts In-Stock

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3,233

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Distributors (Availability)

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$6.900

100+ parts

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693

$6.900

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Parana Technologies

USA . 1,072 parts In-Stock

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$9.260

100+ parts

-

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$9.896

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1,072

$9.260

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$9.896

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DigiPath Technology Company

USA . 610 parts In-Stock

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$10.197

100+ parts

$9.381

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610

$10.197

$9.381

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ChromeModa Solutions

Germany . 1,814 parts In-Stock

1+ parts

$10.405

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$8.532

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1,814

$10.405

$8.532

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$10.405

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$9.885

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$9.364

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1,523

$10.405

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$9.364

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One Stop Electronics

USA . 1,648 parts In-Stock

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$32.000

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$32.000

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Corphita

USA . 2,401 parts In-Stock

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Overview

Enhance your electronic projects with the SN74F251BDRG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This multiplexer & demultiplexer offers seamless switching between multiple input signals to optimize circuit efficiency. With a fast propagation delay of 8 ns and 3-STATE output characteristics, this product ensures reliable performance in various applications. Upgrade your designs with the compact package style and versatile terminal finish options, providing value and flexibility to customers seeking premium electronic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast data processing and transmission, making this product suitable for high-speed applications.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, making this multiplexer/demultiplexer suitable for various systems and setups.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many electronic systems and simplifies power requirements.

Maximum I (ol): 24 Amp

High output current capability allows for driving larger loads, making this multiplexer/demultiplexer suitable for demanding applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling bus sharing and reducing conflicts in multi-device communication systems.

Technology: TTL

TTL technology offers fast switching speeds and compatibility with a wide range of TTL logic devices, ensuring seamless integration in digital systems.

Technical Specifications

Multiplexer & Demultiplexer SN74F251BDRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F251BDRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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