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74AC11257PWRG4

Texas Instruments

74AC11257PWRG4 by Texas Instruments

74AC11257PWRG4 by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 10.1 ns at a nominal voltage of 5V, making it suitable for industrial applications requiring fast signal switching in compact spaces. With a small outline package style and surface mount capability, this device offers efficient performance with a max operating temperature of 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,821 parts In-Stock

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Digiode

USA . 571 parts In-Stock

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AZTECH Wire

Italy . 547 parts In-Stock

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$14.490

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Parana Technologies

USA . 2,185 parts In-Stock

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$26.060

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$26.649

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ChromeModa Solutions

Germany . 1,720 parts In-Stock

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$29.281

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$24.010

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

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$27.817

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$26.353

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One Stop Electronics

USA . 1,292 parts In-Stock

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$42.000

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DigiPath Technology Company

USA . 2,211 parts In-Stock

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Northwest PG Solutions

USA . 1,715 parts In-Stock

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Native Components

USA . 938 parts In-Stock

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Microchip USA

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Corphita

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Overview

Discover the power of Texas Instruments with the 74AC11257PWRG4 multiplexer & demultiplexer. This versatile device offers fast propagation delay and robust surface mount technology, making it ideal for a wide range of applications. With 3-state output characteristics and a true output polarity, this product provides reliable performance in industrial settings. Trust Texas Instruments for quality engineering and innovative solutions that deliver value and efficiency to your projects. Upgrade your systems today with the 74AC11257PWRG4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring the product remains functional for a long time.

Propagation Delay At Nominal Supply: 10.1 ns

Low propagation delay ensures quick and efficient multiplexing/demultiplexing of signals.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board.

No. of Functions: 4

Capable of handling multiple functions simultaneously, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with most circuits and power supplies.

No. of Inputs: 2

Suitable for applications that require multiplexing/demultiplexing of two input signals.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Allows for tri-state logic output, providing more flexibility in controlling connected devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer 74AC11257PWRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

10.1 ns

Propagation Delay (tpd):

10.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74AC11257PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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