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SN74CB3Q3253PWRE4

Texas Instruments

SN74CB3Q3253PWRE4 by Texas Instruments

SN74CB3Q3253PWRE4 by Texas Instruments is a multiplexer and demultiplexer IC with 2 functions, 1 input, and 4 outputs. It operates at a nominal voltage of 2.5V and has a propagation delay of 0.12 ns. This IC is commonly used in industrial applications due to its small size and high temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 252,600 parts In-Stock

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Vyrian

USA . 2,266 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 796 parts In-Stock

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796

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AZTECH Wire

Italy . 822 parts In-Stock

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$12.577

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822

$12.577

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One Stop Electronics

USA . 1,016 parts In-Stock

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$19.000

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$19.000

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Semicontronic

India . 686 parts In-Stock

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$22.000

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$21.450

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$21.340

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686

$22.000

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$21.340

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Parana Technologies

USA . 188 parts In-Stock

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$24.709

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$25.376

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188

$24.709

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$25.376

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DigiPath Technology Company

USA . 1,746 parts In-Stock

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$27.208

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$25.031

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$25.031

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ChromeModa Solutions

Germany . 1,606 parts In-Stock

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$27.763

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$22.766

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$27.763

$22.766

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

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$27.763

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$26.375

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$24.987

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Ampacity Inc.

Singapore . 943 parts In-Stock

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$60.000

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Continental Prestige Electronics

USA . 2,256 parts In-Stock

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Microchip USA

USA . 1,451 parts In-Stock

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Argo Parts USA

USA . 971 parts In-Stock

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Corphita

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Aranea Global

USA . 100 parts In-Stock

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Overview

Experience the pinnacle of quality and reliability with the SN74CB3Q3253PWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a multiplexer and demultiplexer that surpasses all expectations. With its compact design and advanced technology, this versatile device offers seamless switching between multiple inputs, making it perfect for a wide range of applications. From consumer electronics to industrial automation, the SN74CB3Q3253PWRE4 delivers exceptional performance and efficiency. Stay ahead of the game with Texas Instruments and unlock a world of possibilities with this cutting-edge solution.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.12 ns

The product has a very low propagation delay, allowing for fast and efficient data transmission. This ensures that the customer can quickly process and analyze data, saving them time and improving their overall productivity.

Surface Mount: YES

The product can be easily mounted on a circuit board, making installation and integration into existing systems quick and convenient. This saves the customer time and effort in setting up the product.

No. of Functions: 2

The product can perform multiple functions, providing versatility and flexibility to the customer. They can use it for various applications without needing to purchase multiple devices, which saves them money and space.

No. of Inputs: 1

The product has a single input, simplifying the connection process and reducing the risk of errors or complications. This makes it easier for the customer to set up and use the product effectively.

Nominal Supply Voltage / Vsup (V): 2.5

The product operates with a nominal supply voltage of 2.5V, which is a common and widely available power source. This ensures compatibility with existing systems and eliminates the need for additional power sources, saving the customer time and resources.

No. of Terminals: 16

The product has 16 terminals, providing ample connectivity options for the customer. They can easily connect other devices or components to the product, expanding its functionality and enhancing their overall system.

Propagation Delay (tpd): 0.18 ns

The product has a low propagation delay, ensuring fast and accurate data transmission. This results in improved system performance and reduces the risk of data loss or errors, benefiting the customer's operations.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures, allowing it to be used in various environments without the risk of overheating or malfunctioning. This enhances the product's reliability and durability, ensuring its longevity and value for the customer.

Minimum Operating Temperature: -40 °C

The product can operate at low temperatures, making it suitable for use in extreme or harsh environments. This ensures that the customer's operations can continue even in challenging conditions, increasing their efficiency and resilience.

Width: 4.4 mm, Length: 5 mm

The product has a compact size, occupying minimal space on the circuit board or in the customer's system. This saves valuable real estate and allows for more efficient use of space, especially in constrained environments.

No. of Outputs: 4

The product has four outputs, providing multiple channels for data transmission. This enables the customer to send data to different destinations simultaneously, improving their system's capacity and performance.

Technology: CMOS

The product utilizes CMOS technology, which offers low power consumption and high noise immunity. This helps the customer save energy and ensures reliable operation even in noisy environments, contributing to the overall efficiency and reliability of their system.

Maximum Supply Voltage (Vsup): 3.6 V

The product can handle a maximum supply voltage of 3.6V, allowing flexibility in the power source used. This ensures compatibility with a wide range of systems and simplifies integration, benefiting the customer by reducing potential compatibility issues.

Maximum Power Supply Current (ICC): 1.5 mA

The product has a low power supply current, minimizing energy consumption. This helps the customer reduce their operating costs and contributes to a more sustainable and environmentally friendly solution.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The package style is compact and has a thin profile, saving space on the circuit board. The shrink pitch design further enhances space efficiency. These features allow the customer to optimize their system layout and maximize the use of available space.

Terminal Finish: NICKEL PALLADIUM GOLD

The product uses nickel palladium gold as the terminal finish, which provides excellent corrosion resistance and ensures reliable electrical connections. This extends the product's lifespan and reduces the need for maintenance or replacement, saving the customer time and money.

Temperature Grade: INDUSTRIAL

The product is designed for industrial-grade applications, withstanding harsh conditions and maintaining performance and reliability. This makes it suitable for demanding environments, ensuring uninterrupted operation for the customer.

Moisture Sensitivity Level (MSL): 1

The product has a low moisture sensitivity level, reducing the risk of damage from moisture exposure during storage or operation. This enhances the product's durability and reliability, ensuring long-term value for the customer.

Output Characteristics: 3-STATE

The product has 3-state output characteristics, allowing the customer to control the state of the output signals. This provides flexibility and enables the customer to manage data flow effectively, improving their system's performance and versatility.

Technical Specifications

Multiplexer & Demultiplexer SN74CB3Q3253PWRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

1.5 mA

Propagation Delay At Nominal Supply:

.12 ns

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CB3Q3253PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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