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SN74AHC157DRG4

Texas Instruments

SN74AHC157DRG4 by Texas Instruments

SN74AHC157DRG4 by Texas Instruments is a 4-function multiplexer with 2 inputs and 1 output. It has a propagation delay of 9.5 ns and operates at a nominal voltage of 3.3V. This IC is commonly used in automotive applications due to its small size, low power consumption, and high temperature tolerance.

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1k+

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Vyrian

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Digiode

USA . 4,593 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Carlin Systems, Inc.

USA . 497 parts In-Stock

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AZTECH Wire

Italy . 589 parts In-Stock

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$9.156

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One Stop Electronics

USA . 1,066 parts In-Stock

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Parana Technologies

USA . 2,208 parts In-Stock

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$28.760

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$2,670.835

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$25.884

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DigiPath Technology Company

USA . 411 parts In-Stock

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$31.669

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$29.135

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ChromeModa Solutions

Germany . 4,879 parts In-Stock

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$26.498

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IDEA Electronic Components Group

UK . 1,689 parts In-Stock

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$30.699

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$29.084

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Ampacity Inc.

Singapore . 1,044 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Overview

Experience superior performance and reliability with the SN74AHC157DRG4 multiplexer/demultiplexer by Texas Instruments. As a trusted industry leader, Texas Instruments delivers cutting-edge technology that meets the highest quality standards. This versatile device offers customers unmatched value and benefits across a wide range of applications. With its advanced features and efficient design, the SN74AHC157DRG4 provides seamless signal routing and enhanced system flexibility. Trust Texas Instruments for unparalleled innovation and excellence.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy for the package body material makes this product lightweight and durable, making it an excellent choice for various applications.

Propagation Delay At Nominal Supply:

9.5 ns - With a low propagation delay, this multiplexer/demultiplexer allows for fast and efficient data transmission, making it ideal for high-speed applications.

Surface Mount:

YES - Being surface mountable, this product offers easy installation and space-saving benefits, making it suitable for compact electronic designs.

No. of Functions:

4 - With four functions in one device, this multiplexer/demultiplexer provides versatility and can handle multiple signals simultaneously, making it a versatile solution for complex systems.

No. of Inputs:

2 - Having two inputs allows this product to process and combine data from two different sources, providing flexibility in signal routing and management.

Package Shape:

RECTANGULAR - The rectangular package shape offers ease of installation and compatibility with standard mounting techniques, making it convenient to integrate into various systems.

No. of Bits:

2 - With two bits, this multiplexer/demultiplexer can handle binary data efficiently, making it suitable for digital circuits and communication systems.

Nominal Supply Voltage (Vsup):

3.3V - Operating at a standard 3.3V supply voltage, this product is compatible with a wide range of electronic devices, ensuring easy integration into existing systems.

Load Capacitance (CL):

50 pF - With a load capacitance of 50 pF, this multiplexer/demultiplexer can handle capacitively loaded circuits effectively, enhancing its overall performance.

Power Supplies (V):

2/5.5 - Supporting a power supply range of 2V to 5.5V, this product offers flexibility in power source selection, making it suitable for various applications.

No. of Terminals:

16 - With 16 terminals, this multiplexer/demultiplexer allows for easy connection and efficient signal routing, ensuring reliable data transmission in complex systems.

Package Style (Meter):

SMALL OUTLINE - The small outline package style provides compactness and compatibility with modern electronic designs, making it suitable for space-constrained applications.

Maximum I (ol):

8 Amp - With a maximum output current of 8 Amps, this product can handle high-current applications, ensuring robust and reliable operation in demanding environments.

Propagation Delay (tpd):

15 ns - Offering a propagation delay of 15 ns, this multiplexer/demultiplexer provides quick data processing and minimal signal delay, making it ideal for time-sensitive applications.

Maximum Operating Temperature:

125 °C - With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, ensuring stable performance in demanding conditions.

Minimum Operating Temperature:

40 °C - The minimum operating temperature of -40°C allows this multiplexer/demultiplexer to operate reliably in extreme cold conditions, making it suitable for various environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of nickel, palladium, and gold as terminal finishes offers excellent corrosion resistance and ensures reliable electrical contacts, enhancing the product's longevity and performance.

Terminal Position:

DUAL - With a dual terminal position, this product provides flexibility in connecting and routing signals, enhancing compatibility with different circuit layouts and configurations.

Maximum Seated Height:

1.75 mm - With a maximum seated height of 1.75 mm, this product offers a space-saving solution, making it suitable for slim and compact electronic designs.

Width:

3.9 mm - The compact width of 3.9 mm allows for easy integration of this multiplexer/demultiplexer into various electronic systems, enhancing versatility and design flexibility.

Output Polarity:

TRUE - The output polarity feature ensures accurate voltage levels and signal compatibility, making this product reliable for precise signal routing and transmission.

Minimum Supply Voltage (Vsup):

2 V - Supporting a minimum supply voltage of 2V, this product is capable of operating with low power sources, making it energy-efficient and suitable for battery-powered applications.

Peak Reflow Temperature °C:

260 - With a peak reflow temperature of 260°C, this multiplexer/demultiplexer can withstand high-temperature soldering processes, ensuring reliable manufacturing assembly and robust solder joints.

Length:

9.9 mm - The compact length of 9.9 mm allows for easy integration and placement of this multiplexer/demultiplexer in various electronic systems, optimizing space utilization.

Temperature Grade:

AUTOMOTIVE - Designed to meet automotive temperature requirements, this product can operate reliably in automotive environments, making it suitable for automotive applications.

Technology:

CMOS - Built with CMOS technology, this multiplexer/demultiplexer offers low power consumption, high noise immunity, and high-speed operation, making it an efficient choice for digital applications.

Terminal Form:

GULL WING - The gull wing terminal form provides excellent mechanical strength and ensures secure solder connections, making this product reliable in demanding environments and during manufacturing processes.

Packing Method:

TR - The tape and reel packing method enables automated handling and pick-and-place assembly, enhancing efficiency during manufacturing and reducing the risk of damage during transportation and storage.

Terminal Pitch:

1.27 mm - With a terminal pitch of 1.27 mm, this product allows for precise and reliable connections, making it suitable for compact circuit layouts and high-density applications.

Moisture Sensitivity Level (MSL):

1 - With an MSL of 1, this multiplexer/demultiplexer has a low moisture sensitivity, reducing the risk of moisture-related failures during manufacturing, storage, and reflow soldering processes.

Maximum Supply Voltage (Vsup):

5.5 V - Supporting a maximum supply voltage of 5.5V, this product can handle higher power sources, making it versatile and compatible with various electronic systems.

Maximum Power Supply Current (ICC):

0.04 mA - With a maximum power supply current of 0.04 mA, this product exhibits low power consumption, leading to energy efficiency and extended battery life.

No. of Outputs:

1 - Providing a single output, this multiplexer/demultiplexer simplifies signal routing and management, making it suitable for applications requiring a consolidated output signal.

Technical Specifications

Multiplexer & Demultiplexer SN74AHC157DRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AHC157DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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