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74AC11158DWR

Texas Instruments

74AC11158DWR by Texas Instruments

74AC11158DWR by Texas Instruments is a multiplexer/demultiplexer with 4 functions and 2 inputs. It has a propagation delay of 7.9 ns at a nominal voltage of 5V, making it suitable for industrial applications requiring fast signal switching in compact designs. With surface mount capability and small outline package style, it offers high performance in limited space environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,234 parts In-Stock

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Digiode

USA . 1,926 parts In-Stock

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AZTECH Wire

Italy . 518 parts In-Stock

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$7.045

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518

$7.045

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One Stop Electronics

USA . 479 parts In-Stock

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$12.000

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479

$12.000

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Parana Technologies

USA . 1,515 parts In-Stock

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$22.845

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$23.505

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$22.845

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$23.505

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ChromeModa Solutions

Germany . 4,168 parts In-Stock

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$25.668

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$21.048

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4,168

$25.668

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

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$25.668

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$24.385

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$23.101

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1,584

$25.668

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$23.101

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Corphita

USA . 1,584 parts In-Stock

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DigiPath Technology Company

USA . 1,199 parts In-Stock

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$23.142

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Native Components

USA . 905 parts In-Stock

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Northwest PG Solutions

USA . 756 parts In-Stock

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Overview

Discover the power and precision of the Texas Instruments 74AC11158DWR multiplexer & demultiplexer. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers a top-tier product that offers unmatched performance and reliability. Ideal for a variety of applications, this versatile device boasts a range of benefits including fast propagation delay, low power consumption, and a compact design. Trust in Texas Instruments to provide the quality and innovation you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 7.9 ns

The low propagation delay ensures fast and efficient data transmission within the multiplexer/demultiplexer, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the PCB, making it a convenient choice for compact designs.

No. of Functions: 4

Having 4 functions in a single device increases efficiency and reduces the need for multiple components, making it cost-effective and space-saving.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common voltage in many electronic systems, ensuring compatibility and ease of integration.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making the product efficient and versatile.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for use in harsh environments or industrial applications where temperature variations are common.

Technical Specifications

Multiplexer & Demultiplexer 74AC11158DWR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS

Family:

AC

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

7.9 ns

Propagation Delay (tpd):

7.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

74AC11158DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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