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74AC11153DR

Texas Instruments

74AC11153DR by Texas Instruments

74AC11153DR by Texas Instruments is a dual-function multiplexer/demultiplexer with 4 inputs, 2 functions, and a propagation delay of 8.6 ns. It operates at a nominal voltage of 5V and can handle load capacitance up to 50 pF. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,814 parts In-Stock

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Digiode

USA . 390 parts In-Stock

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390

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AZTECH Wire

Italy . 789 parts In-Stock

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$7.964

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789

$7.964

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Parana Technologies

USA . 1,008 parts In-Stock

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$12.093

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$12.503

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$12.093

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DigiPath Technology Company

USA . 2,092 parts In-Stock

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$13.316

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ChromeModa Solutions

Germany . 2,525 parts In-Stock

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$13.588

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$11.142

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$13.588

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IDEA Electronic Components Group

UK . 559 parts In-Stock

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$13.588

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$12.909

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$12.229

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559

$13.588

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$12.229

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One Stop Electronics

USA . 1,037 parts In-Stock

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$26.000

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Northwest PG Solutions

USA . 1,232 parts In-Stock

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Corphita

USA . 816 parts In-Stock

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Native Components

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Overview

Discover the power of seamless data management with the Texas Instruments 74AC11153DR multiplexer & demultiplexer. Crafted with precision by a trusted manufacturer, this innovative device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this versatile component provides customers with unmatched value, efficiency, and ease of use. Upgrade your systems today with the Texas Instruments 74AC11153DR and experience a new level of quality and functionality in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, reducing the time and effort required for assembly.

Propagation Delay (tpd): 8.6 ns

Low propagation delay ensures fast data transfer, making this product suitable for applications where speed is crucial.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and devices, making it a versatile choice for various applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this multiplexer/demultiplexer can operate in harsh environmental conditions, making it suitable for industrial settings.

Technical Specifications

Multiplexer & Demultiplexer 74AC11153DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS

Family:

AC

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

74AC11153DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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