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74AC11157J

Texas Instruments

74AC11157J by Texas Instruments

The Texas Instruments 74AC11157J is a CMOS multiplexer/demultiplexer with 4 functions and 2 inputs. It operates at temperatures ranging from -40°C to 85°C, suitable for industrial applications. With a package style of IN-LINE and terminal pitch of 2.54mm, it offers flexibility in circuit design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,261 parts In-Stock

1+ parts

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3,261

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Digiode

USA . 1,360 parts In-Stock

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1,360

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 525 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

-

10k+ parts

$0.360

525

$0.375

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-

$0.360

Northwest PG Solutions

USA . 591 parts In-Stock

1+ parts

$0.413

100+ parts

-

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$0.364

591

$0.413

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-

$0.364

AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$6.732

100+ parts

-

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443

$6.732

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Parana Technologies

USA . 693 parts In-Stock

1+ parts

$10.556

100+ parts

-

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$11.059

10k+ parts

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693

$10.556

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$11.059

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$11.624

100+ parts

$10.694

1k+ parts

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1,507

$11.624

$10.694

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ChromeModa Solutions

Germany . 3,241 parts In-Stock

1+ parts

$11.861

100+ parts

$9.726

1k+ parts

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3,241

$11.861

$9.726

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IDEA Electronic Components Group

UK . 767 parts In-Stock

1+ parts

$11.861

100+ parts

$11.268

1k+ parts

$10.675

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767

$11.861

$11.268

$10.675

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One Stop Electronics

USA . 591 parts In-Stock

1+ parts

$42.000

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591

$42.000

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Corphita

USA . 1,105 parts In-Stock

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1,105

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Overview

Elevate your electronic designs with the 74AC11157J by Texas Instruments, a top-tier multiplexer and demultiplexer housed in a durable ceramic package. With its versatile functionality and high-quality construction, this innovative product is ideal for a wide range of applications. Experience seamless performance and enhanced efficiency with the 4 functions, 2 inputs, and 3.3/5V power supplies. Trust in Texas Instruments' reputation for excellence and reliability as you elevate your projects to new heights. Choose the 74AC11157J for unparalleled value, benefits, and advantages that will set your creations apart.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and heat resistance, making this product suitable for industrial environments.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space in the circuit design.

No. of Inputs: 2

Having 2 inputs allows for flexibility in the signal routing and selection process.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages enables compatibility with different systems and applications.

No. of Terminals: 20

Having a sufficient number of terminals allows for easy connectivity and integration into the circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, enhancing the durability and longevity of the product.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy installation and compatibility with common electronic components.

Technical Specifications

Multiplexer & Demultiplexer 74AC11157J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74AC11157J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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