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74AC11158J

Texas Instruments

74AC11158J by Texas Instruments

The Texas Instruments 74AC11158J is a CMOS multiplexer/demultiplexer with 4 functions, 2 inputs, and operates at temperatures from -40 to 85°C. It has 20 terminals in an in-line package style suitable for industrial applications requiring ceramic package material and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,928 parts In-Stock

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5,928

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Digiode

USA . 2,941 parts In-Stock

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2,941

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Distributors (Availability)

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Native Components

USA . 741 parts In-Stock

1+ parts

$7.230

100+ parts

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741

$7.230

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One Stop Electronics

USA . 283 parts In-Stock

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$8.000

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283

$8.000

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Parana Technologies

USA . 1,545 parts In-Stock

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$9.373

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$9.994

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1,545

$9.373

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$9.994

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ChromeModa Solutions

Germany . 5,269 parts In-Stock

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$10.531

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$8.635

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5,269

$10.531

$8.635

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IDEA Electronic Components Group

UK . 213 parts In-Stock

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$10.531

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$10.004

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$9.478

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213

$10.531

$10.004

$9.478

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AZTECH Wire

Italy . 728 parts In-Stock

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$15.205

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728

$15.205

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Corphita

USA . 2,454 parts In-Stock

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2,454

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Northwest PG Solutions

USA . 1,191 parts In-Stock

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$7.085

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1,191

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$7.085

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DigiPath Technology Company

USA . 400 parts In-Stock

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$9.495

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400

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$9.495

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Overview

Discover the power of the 74AC11158J by Texas Instruments, a high-quality multiplexer and demultiplexer designed to enhance your electronic projects. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this versatile component offers reliability and efficiency. Ideal for applications requiring signal routing and selection, the 74AC11158J boasts four functions and two inputs, making it a valuable addition to your toolkit. Experience seamless integration and superior performance with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making the product suitable for operation in a wide range of temperatures.

No. of Functions: 4

Having the capability to handle multiple functions in a single device can lead to space and cost savings in a circuit design.

No. of Inputs: 2

Allows for multiple input signals to be processed or combined, providing flexibility in signal routing and management.

Package Shape: RECTANGULAR

Rectangular shape is easy to integrate into circuit board layouts, optimizing space utilization.

Power Supplies (V): 3.3/5

Supports a range of power supply voltages, making it versatile for use in different systems or environments.

No. of Terminals: 20

Sufficient terminals for connecting the device effectively within a circuit, ensuring reliable signal transmission.

Package Style (Meter): IN-LINE

In-line package style is convenient for wiring and integration into existing circuit setups.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, offering reliability under varying conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, ensuring performance in extreme conditions.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity, reducing the risk of signal loss or interference.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product's durability and reliability in demanding industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and easy soldering, ensuring secure connections within a circuit.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates compatibility with various circuit board layouts, simplifying installation and maintenance.

Technical Specifications

Multiplexer & Demultiplexer 74AC11158J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74AC11158J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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