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74AC11151J

Texas Instruments

74AC11151J by Texas Instruments

74AC11151J by Texas Instruments is a CMOS multiplexer with 8 inputs, operating at temperatures from -40 to 85°C. It has dual terminals on a ceramic package body, suitable for industrial applications requiring power supplies of 3.3/5V. The rectangular in-line package style with 16 terminals and a terminal pitch of 2.54mm makes it versatile for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,672 parts In-Stock

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Digiode

USA . 1,589 parts In-Stock

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Native Components

USA . 924 parts In-Stock

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$0.540

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Northwest PG Solutions

USA . 1,877 parts In-Stock

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$0.594

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AZTECH Wire

Italy . 386 parts In-Stock

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$18.102

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One Stop Electronics

USA . 609 parts In-Stock

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$29.000

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Parana Technologies

USA . 1,866 parts In-Stock

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$29.834

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$63.792

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DigiPath Technology Company

USA . 838 parts In-Stock

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$32.851

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$30.223

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ChromeModa Solutions

Germany . 6,073 parts In-Stock

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$27.487

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IDEA Electronic Components Group

UK . 793 parts In-Stock

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Corphita

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Overview

Looking for a high-quality multiplexer & demultiplexer for your electronic projects? Look no further than the 74AC11151J by Texas Instruments. With a durable ceramic package body and industrial-grade temperature rating, this versatile component offers reliability and performance. The 74AC11151J features 8 inputs, dual terminal position, and a convenient in-line package style. Whether you're working on robotics, telecommunications, or industrial automation, this product provides the value, benefits, and advantages you need to bring your designs to life. Trust Texas Instruments for top-notch components that deliver results.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and mechanical strength, making the product durable and reliable for industrial applications.

No. of Inputs: 8

Having 8 inputs allows for multiplexing or demultiplexing of multiple data streams efficiently, increasing the versatility of the product.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies, the product offers flexibility in operation and compatibility with various systems.

No. of Terminals: 16

With 16 terminals, the product can easily connect to multiple interfaces or components, enhancing its functionality in complex setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh industrial environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in extreme cold conditions, increasing its usability range.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and easier soldering, ensuring stable and robust connections in demanding applications.

Technical Specifications

Multiplexer & Demultiplexer 74AC11151J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74AC11151J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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