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SN74CBT3257PWR

Texas Instruments

SN74CBT3257PWR by Texas Instruments

SN74CBT3257PWR by Texas Instruments is a 4-function multiplexer with a propagation delay of 0.25 ns at 5V. It features a small outline package, operates in industrial temperatures (-40 to 85 °C), and has 3-state output characteristics. Ideal for applications requiring fast signal switching in compact designs.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

29

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1k+

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Verical

USA . 3,385 parts In-Stock

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DigiKey

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Arrow

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Rochester

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Mouser Electronics

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Chip1Stop

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Nova Conductors

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Digiode

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R&J Components

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Chip Stock

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PC Components Company LLC

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ComSIT Distribution GmbH

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DigiKey Marketplace

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Bristol Electronics

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Cyclops Electronics Ltd

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Legend Electronics Inc.

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Vyrian

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DF Sales Co.

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Elcom Components

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ACDS - Activité Composants Distribution Service

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Microfarads

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Mil-Aero Solutions, Inc.

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First Choice Components Inc.

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

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Prism Electronics

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CoreStaff

Japan . 29 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Corohmni

South Africa . 285 parts In-Stock

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Ampacity Inc.

Singapore . 1,704 parts In-Stock

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Semicontronic

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Corphita

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Parana Technologies

USA . 223 parts In-Stock

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DigiPath Technology Company

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 310 parts In-Stock

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Perfect Parts

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Kepictronics

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Glotronic Ltd.

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Overview

Elevate your electronics with the SN74CBT3257PWR by Texas Instruments, a top-tier multiplexer & demultiplexer that guarantees exceptional quality and performance. Designed with precision and expertise, this product offers unparalleled value to customers seeking reliability and efficiency in their applications. With a wide range of functions and advanced technology, the SN74CBT3257PWR is the perfect choice for industrial-grade projects that demand superior output characteristics and precise signal routing. Upgrade your systems today with Texas Instruments' cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides good protection and durability for the product.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient signal processing.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into circuit boards.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space in circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal 5V supply voltage makes it compatible with common electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures reliable performance in various applications.

Output Characteristics: 3-STATE

3-state output allows for high flexibility and versatility in signal routing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer SN74CBT3257PWR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE MUX/DMUX SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CBT3257PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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