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SN74HC257PWTG4

Texas Instruments

SN74HC257PWTG4 by Texas Instruments

SN74HC257PWTG4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 25ns. Operating b/w -40 to 85°C, it has a supply voltage range of 2-6V and can handle load capacitance up to 50pF. Ideal for industrial applications requiring high-speed signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,282 parts In-Stock

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Digiode

USA . 437 parts In-Stock

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437

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Distributors (Availability)

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Parana Technologies

USA . 2,035 parts In-Stock

1+ parts

$8.623

100+ parts

-

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$9.293

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2,035

$8.623

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$9.293

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DigiPath Technology Company

USA . 1,044 parts In-Stock

1+ parts

$9.495

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1,044

$9.495

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ChromeModa Solutions

Germany . 6,311 parts In-Stock

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$9.689

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$7.945

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6,311

$9.689

$7.945

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

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$9.689

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$9.205

1k+ parts

$8.720

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1,943

$9.689

$9.205

$8.720

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AZTECH Wire

Italy . 362 parts In-Stock

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$17.242

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362

$17.242

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One Stop Electronics

USA . 765 parts In-Stock

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$41.000

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765

$41.000

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Corphita

USA . 2,786 parts In-Stock

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Overview

Experience the unmatched quality of Texas Instruments with the SN74HC257PWTG4, a versatile Multiplexer & Demultiplexer that offers exceptional performance and reliability. Perfect for a wide range of applications, this product boasts a compact design and fast propagation delay, making it an ideal choice for your projects. With Texas Instruments' renowned reputation for innovation and excellence, you can trust that this product will deliver outstanding results. Upgrade your designs and experience the benefits of superior technology with the SN74HC257PWTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making this product reliable for long-term use.

Propagation Delay At Nominal Supply: 25 ns

The low propagation delay at nominal supply ensures fast and efficient signal processing, making this product suitable for high-speed applications.

No. of Functions: 4

With 4 functions in one device, this multiplexer & demultiplexer offers versatility and flexibility in signal routing, making it a cost-effective solution for multiple input/output scenarios.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power sources and can be easily integrated into existing systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in harsh environmental conditions, making this product suitable for industrial applications.

Technical Specifications

Multiplexer & Demultiplexer SN74HC257PWTG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74HC257PWTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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