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SN74HC356DW3

Texas Instruments

SN74HC356DW3 by Texas Instruments

SN74HC356DW3 by Texas Instruments is an 8-input multiplexer with a package style of small outline. It operates b/w -40°C to 85°C, making it suitable for industrial applications. With 20 terminals and CMOS technology, this device offers 3-state output characteristics for versatile circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,548 parts In-Stock

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3,548

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Digiode

USA . 2,505 parts In-Stock

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2,505

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Distributors (Availability)

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$7.012

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738

$7.012

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Parana Technologies

USA . 1,668 parts In-Stock

1+ parts

$26.675

100+ parts

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$27.230

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1,668

$26.675

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$27.230

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DigiPath Technology Company

USA . 716 parts In-Stock

1+ parts

$29.373

100+ parts

$27.023

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716

$29.373

$27.023

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ChromeModa Solutions

Germany . 477 parts In-Stock

1+ parts

$29.972

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$24.577

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477

$29.972

$24.577

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IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$29.972

100+ parts

$28.473

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$26.975

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146

$29.972

$28.473

$26.975

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One Stop Electronics

USA . 881 parts In-Stock

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$64.000

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881

$64.000

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Corphita

USA . 4,330 parts In-Stock

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Overview

Upgrade your electronic projects with the SN74HC356DW3 by Texas Instruments, a high-quality multiplexer & demultiplexer designed to meet the needs of industrial applications. With 8 inputs and 3-state output characteristics, this product offers unmatched performance and reliability. The small outline package shape makes it ideal for space-constrained designs, while the advanced CMOS technology ensures efficient operation. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects to the next level with the SN74HC356DW3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the multiplexer & demultiplexer.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and simplifying assembly.

No. of Inputs: 8

With 8 inputs, this multiplexer & demultiplexer can handle a wide range of signals and data sources simultaneously.

Power Supplies (V): 2/6

Compatibility with power supplies of 2V and 6V provides flexibility in different operating environments.

Package Shape: RECTANGULAR

Rectangular package shape is convenient for placement and integration into electronic systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Output Characteristics: 3-STATE

3-STATE output characteristics offer additional versatility in managing signals and data transmission.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making this product efficient and effective.

Technical Specifications

Multiplexer & Demultiplexer SN74HC356DW3 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC356DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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