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SN74ALS157FN-00

Texas Instruments

SN74ALS157FN-00 by Texas Instruments

SN74ALS157FN-00 by Texas Instruments is a 4:1 multiplexer with 2 inputs, operating at 5V. It comes in a square chip carrier package style, suitable for commercial temperature grades. This TTL technology device has J bend terminals and is ideal for signal routing applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,034 parts In-Stock

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Digiode

USA . 807 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 626 parts In-Stock

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$10.396

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626

$10.396

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Parana Technologies

USA . 26 parts In-Stock

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$23.729

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$24.360

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26

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DigiPath Technology Company

USA . 2,345 parts In-Stock

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$26.129

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$26.129

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ChromeModa Solutions

Germany . 5,739 parts In-Stock

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$26.662

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$21.863

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IDEA Electronic Components Group

UK . 395 parts In-Stock

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$26.662

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$25.329

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$23.996

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395

$26.662

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$23.996

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One Stop Electronics

USA . 747 parts In-Stock

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$31.000

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Corphita

USA . 2,053 parts In-Stock

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Overview

Unlock the power of seamless data integration with the Texas Instruments SN74ALS157FN-00 multiplexer & demultiplexer. Designed with precision and reliability in mind, Texas Instruments delivers unmatched quality in every product. Ideal for a wide range of applications, this versatile chip carrier offers customers the value of efficient data processing and maximized performance. Experience the benefits of true output polarity and commercial-grade temperature tolerance, ensuring smooth operations in any environment. Upgrade your systems today with the Texas Instruments SN74ALS157FN-00.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

Having 4 functions in one device can help reduce component count and board space, leading to a more compact and cost-effective solution.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer offers flexibility in routing signals and data, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and voltage levels in most electronic systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor, making it easy to handle and mount on PCBs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C indicates that the device can operate in a wide range of temperature environments.

Terminal Position: QUAD

The quad terminal position allows for secure soldering connections and stable electrical contact, ensuring reliable performance.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57mm enables the device to be mounted in space-constrained applications without compromising on performance.

Width: 8.9662 mm

With a compact width of 8.9662mm, the device can be easily integrated into densely populated PCB layouts, saving precious board space.

Output Polarity: TRUE

Having true output polarity ensures accurate signal processing and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5V allows the device to operate efficiently in low-power scenarios, saving energy and reducing costs.

Length: 8.9662 mm

With a compact length of 8.9662mm, the device can be easily accommodated in tight spaces or integrated into small form factor electronic devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures widespread compatibility and availability for various consumer and industrial applications.

Technology: TTL

Utilizing TTL technology ensures reliable signal processing and compatibility with other TTL-based components in the system.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure soldering connections, ensuring reliable electrical contact and performance.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and compact mounting on PCBs, ensuring reliable electrical connections and signal integrity.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the device can withstand transient voltage spikes or fluctuations without compromising performance or reliability.

Technical Specifications

Multiplexer & Demultiplexer SN74ALS157FN-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

SN74ALS157FN-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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