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SN74ALVC16260DGG

Texas Instruments

SN74ALVC16260DGG by Texas Instruments

SN74ALVC16260DGG by Texas Instruments is a 12-function multiplexer with a supply voltage range of 2.3V to 3.6V, suitable for industrial applications. It features a small outline package style, operates b/w -40°C to 85°C, and offers 3-state output characteristics. Ideal for compact designs requiring high performance in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,062 parts In-Stock

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Vyrian

USA . 3,642 parts In-Stock

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3,642

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Distributors (Availability)

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$15.550

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841

$15.550

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Parana Technologies

USA . 2,154 parts In-Stock

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$19.430

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$19.443

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2,154

$19.430

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$19.443

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DigiPath Technology Company

USA . 1,846 parts In-Stock

1+ parts

$21.395

100+ parts

$19.684

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1,846

$21.395

$19.684

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ChromeModa Solutions

Germany . 6,524 parts In-Stock

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$21.832

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$17.902

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6,524

$21.832

$17.902

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$21.832

100+ parts

$20.740

1k+ parts

$19.649

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2,369

$21.832

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$19.649

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One Stop Electronics

USA . 1,577 parts In-Stock

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$38.000

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1,577

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Corphita

USA . 4,329 parts In-Stock

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Overview

Unlock a world of possibilities with the SN74ALVC16260DGG by Texas Instruments, a versatile Multiplexer & Demultiplexer that offers high-quality performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the demanding requirements of industrial applications. With 12 functions packed into a compact package, this device provides exceptional value and benefits to customers looking for seamless integration and efficient operation. Trust Texas Instruments for cutting-edge technology that delivers outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various industrial applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and improving efficiency.

No. of Functions: 12

With 12 functions in one device, this multiplexer/demultiplexer offers high functionality and versatility for complex signal routing applications.

Nominal Supply Voltage / Vsup (V): 2.5

The specified supply voltage of 2.5V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 56

Having 56 terminals allows for multiple connections and signal routing options, enabling the device to handle diverse input and output requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh industrial environments with elevated temperatures.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in managing signal outputs, allowing for tri-state control and efficient signal switching.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the device can operate reliably in cold environments without compromising performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and excellent signal integrity, making the multiplexer/demultiplexer energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer SN74ALVC16260DGG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

No. of Functions:

12

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

SN74ALVC16260DGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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