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SN74CBT3251DBQRG4

Texas Instruments

SN74CBT3251DBQRG4 by Texas Instruments

SN74CBT3251DBQRG4 by Texas Instruments is a CMOS multiplexer with 16 terminals and 8 outputs. It has a propagation delay of 0.35 ns at 5V, making it ideal for high-speed applications. With a small outline package style and true output polarity, it is suitable for industrial use in systems requiring fast signal switching.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 34,502 parts In-Stock

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Vyrian

USA . 7,252 parts In-Stock

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Nova Conductors

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Digiode

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AZTECH Wire

Italy . 545 parts In-Stock

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$10.490

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Parana Technologies

USA . 2,055 parts In-Stock

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$15.168

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$15.568

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DigiPath Technology Company

USA . 621 parts In-Stock

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$16.702

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$15.366

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ChromeModa Solutions

Germany . 4,382 parts In-Stock

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$13.975

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IDEA Electronic Components Group

UK . 165 parts In-Stock

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$16.191

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One Stop Electronics

USA . 1,301 parts In-Stock

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Corohmni

South Africa . 77 parts In-Stock

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Semicontronic

India . 1,594 parts In-Stock

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Ampacity Inc.

Singapore . 252 parts In-Stock

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Continental Prestige Electronics

USA . 4,824 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Overview

Enhance your electronic designs with the SN74CBT3251DBQRG4 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This versatile multiplexer & demultiplexer offers unmatched performance and precision in signal routing applications, ensuring seamless operation and efficient signal processing. With a compact package design and low power consumption, this product delivers exceptional value and flexibility to customers looking to optimize their circuit designs. Trust Texas Instruments for innovative solutions that elevate your projects to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.24 ns

This fast propagation delay ensures quick and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making it convenient for integration into various electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of electronic systems and power supplies.

No. of Terminals: 16

Having a sufficient number of terminals allows for multiple input and output connections, increasing the versatility and functionality of the product.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the product to disconnect from the output bus, reducing interference and improving overall signal integrity in complex circuit designs.

Technology: CMOS

Being based on CMOS technology, the product consumes low power while providing high speed and reliability, making it an energy-efficient choice for electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Supply Voltage (Vsup): 4 V

The product can operate at a low minimum supply voltage of 4V, making it compatible with a wide range of power sources and ensuring flexibility in usage.

Technical Specifications

Multiplexer & Demultiplexer SN74CBT3251DBQRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.24 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74CBT3251DBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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