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SN74F258N

Texas Instruments

SN74F258N by Texas Instruments

SN74F258N by Texas Instruments is a 4-bit multiplexer with 2 inputs and 3-STATE output. It operates at a supply voltage of 5V, has a propagation delay of 6ns, and can handle a load capacitance of 50pF. This TTL technology device is commonly used in commercial applications requiring signal routing and selection.

Median Price

$0.740

Lifecycle Status

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$0.642

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$0.557

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$0.523

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$1.120

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Rochester

USA . 14,055 parts In-Stock

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$0.645

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$0.535

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$0.477

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DigiKey

USA . 14,055 parts In-Stock

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Verical

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Vyrian

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Digiode

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American Microsemiconductor Inc.

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Component Electronics Inc.

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DigiKey Marketplace

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Connector Distribution Corp

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Microchip USA

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Parana Technologies

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DigiPath Technology Company

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the SN74F258N multiplexer & demultiplexer. Perfect for a wide range of applications, this versatile component offers customers exceptional value by providing fast propagation delay, low power consumption, and 3-state output characteristics. With 4 functions and 2 inputs, the SN74F258N is a must-have for any project requiring precision and efficiency. Trust Texas Instruments for top-of-the-line components that deliver superior performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay ensures quick data transmission, making this multiplexer & demultiplexer suitable for high-speed applications.

No. of Functions: 4

Having 4 functions allows for versatile use and integration in various circuit designs.

No. of Inputs: 2

With 2 inputs, this multiplexer can handle multiple input signals efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with most systems and easy to integrate.

No. of Terminals: 16

Having 16 terminals offers flexibility in connecting to other components and peripherals in the circuit.

Output Characteristics: 3-STATE

3-state outputs allow for better control over the output signals, providing more options for data transmission.

Technology: TTL

TTL technology ensures compatibility with other TTL components and provides reliable performance.

Technical Specifications

Multiplexer & Demultiplexer SN74F258N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

23 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74F258N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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