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SN74HC151D-00

Texas Instruments

SN74HC151D-00 by Texas Instruments

SN74HC151D-00 by Texas Instruments is an 8-input multiplexer with a propagation delay of 88 ns. Operating at a supply voltage range of 2V to 6V, it is ideal for industrial applications requiring fast signal switching. This CMOS technology device comes in a small outline package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,606 parts In-Stock

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Digiode

USA . 3,142 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,759 parts In-Stock

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$10.902

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$11.373

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1,759

$10.902

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$11.373

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AZTECH Wire

Italy . 557 parts In-Stock

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$10.919

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DigiPath Technology Company

USA . 187 parts In-Stock

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$12.005

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187

$12.005

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ChromeModa Solutions

Germany . 6,516 parts In-Stock

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$12.250

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$10.045

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$12.250

$10.045

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IDEA Electronic Components Group

UK . 820 parts In-Stock

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$12.250

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$11.638

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$11.025

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820

$12.250

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$11.025

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One Stop Electronics

USA . 1,421 parts In-Stock

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$21.000

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Corphita

USA . 2,151 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN74HC151D-00 by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer offers seamless performance and versatility for a wide range of applications. With its compact design, low power consumption, and high-speed operation, this product provides exceptional value and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that meets the demands of industrial-grade environments. Upgrade your systems with the SN74HC151D-00 and enjoy superior functionality and precision like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for various industrial applications.

Surface Mount: YES

Being surface mountable, this product is easily integrated into circuit boards, saving space and simplifying assembly processes.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can handle multiple signals efficiently, making it suitable for complex data routing.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Propagation Delay (tpd): 88 ns

The low propagation delay of 88 ns ensures fast signal processing, making this product ideal for applications requiring quick data transmission.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C allows this product to function reliably in various environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers high speed, low power consumption, and noise immunity, making it a reliable choice for data handling applications.

Technical Specifications

Multiplexer & Demultiplexer SN74HC151D-00 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

88 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SN74HC151D-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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