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SN74HC354JP4

Texas Instruments

SN74HC354JP4 by Texas Instruments

SN74HC354JP4 by Texas Instruments is an 8-input multiplexer with a package style of IN-LINE and ceramic body material. It operates b/w -40°C to 85°C, has 3-STATE output characteristics, and uses CMOS technology. Ideal for industrial applications requiring high temperature tolerance and versatile signal routing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,271 parts In-Stock

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3,271

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Digiode

USA . 2,260 parts In-Stock

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2,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 208 parts In-Stock

1+ parts

$8.553

100+ parts

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$9.209

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208

$8.553

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$9.209

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DigiPath Technology Company

USA . 1,678 parts In-Stock

1+ parts

$9.418

100+ parts

$8.664

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1,678

$9.418

$8.664

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ChromeModa Solutions

Germany . 2,305 parts In-Stock

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$9.610

100+ parts

$7.880

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2,305

$9.610

$7.880

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$9.610

100+ parts

$9.130

1k+ parts

$8.649

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2,116

$9.610

$9.130

$8.649

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AZTECH Wire

Italy . 864 parts In-Stock

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$13.634

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864

$13.634

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One Stop Electronics

USA . 1,113 parts In-Stock

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$23.000

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1,113

$23.000

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Corphita

USA . 2,741 parts In-Stock

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2,741

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Overview

Elevate your electronic projects with the SN74HC354JP4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The SN74HC354JP4 falls under the category of Multiplexer & Demultiplexer, offering versatility and efficiency for a wide range of applications. With 8 inputs and 3-STATE output characteristics, this product provides exceptional performance and functionality. Whether you're a hobbyist or a professional, the SN74HC354JP4 is the perfect choice for enhancing your circuit designs. Experience the value and benefits that Texas Instruments brings to the table with this top-notch component.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent mechanical strength, ensuring durability and efficient heat dissipation in the device.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer provides flexibility in handling multiple input signals or data streams simultaneously.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into electronic circuits or systems.

Power Supplies (V): 2/6

Support for dual power supplies allows for versatile voltage configurations, enhancing compatibility with different systems.

No. of Terminals: 20

With 20 terminals, this device offers ample connectivity options for input and output signals, ensuring efficient data processing.

Package Style (Meter): IN-LINE

In-line package style is space-efficient and ideal for applications where compact design is important.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh industrial environments with elevated temperatures.

Output Characteristics: 3-STATE

3-state output allows for multiple output states (high, low, and high impedance), enabling efficient data transmission and signal control.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the device can function in a wide range of operating conditions, including cold environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the device to external circuits or devices, allowing for easier integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure the device is suitable for use in demanding industrial applications with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the device energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is robust and reliable, providing secure connections and easy soldering during assembly or installation.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy interfacing with other components or PCBs, simplifying the integration process and reducing assembly time.

Technical Specifications

Multiplexer & Demultiplexer SN74HC354JP4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC354JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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