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SN74AS153NSRG4

Texas Instruments

SN74AS153NSRG4 by Texas Instruments

SN74AS153NSRG4 by Texas Instruments is a TTL technology multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 4.5V to 5.5V, has a propagation delay of 12.5ns, and can withstand temperatures from 0°C to 70°C. Ideal for commercial applications requiring fast signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,568 parts In-Stock

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8,568

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Digiode

USA . 2,513 parts In-Stock

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2,513

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Distributors (Availability)

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AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$12.500

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601

$12.500

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Parana Technologies

USA . 1,479 parts In-Stock

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$17.905

100+ parts

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1k+ parts

$18.075

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1,479

$17.905

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$18.075

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DigiPath Technology Company

USA . 1,912 parts In-Stock

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$19.716

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1,912

$19.716

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ChromeModa Solutions

Germany . 6,538 parts In-Stock

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$20.118

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$16.497

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6,538

$20.118

$16.497

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IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$20.118

100+ parts

$19.112

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$18.106

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703

$20.118

$19.112

$18.106

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One Stop Electronics

USA . 733 parts In-Stock

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$33.000

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733

$33.000

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Corphita

USA . 259 parts In-Stock

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259

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Overview

Unlock endless possibilities with the Texas Instruments SN74AS153NSRG4 Multiplexer & Demultiplexer. Crafted with precision and expertise by a world-renowned manufacturer, this component offers reliability and superior performance. Ideal for a wide range of applications, this product provides seamless integration and efficiency. Experience the value of smooth operations, enhanced functionality, and unmatched quality with the SN74AS153NSRG4. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and improving overall efficiency.

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in circuit design.

No. of Inputs: 4

With 4 inputs, this multiplexer/demultiplexer can handle multiple signals or data streams effectively.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, making it compatible with many systems.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration within a circuit.

Propagation Delay (tpd): 12.5 ns

Low propagation delay ensures quick switching between inputs, improving overall performance.

Maximum Operating Temperature: 70 °C

Can operate effectively in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Can handle low-temperature conditions, making it versatile for various operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance for reliable connections.

Width: 5.3 mm

Narrow width saves space on the PCB, which is essential in compact electronic designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without any distortion.

Technology: TTL

TTL technology offers fast and reliable digital signal processing, suitable for high-speed applications.

Technical Specifications

Multiplexer & Demultiplexer SN74AS153NSRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74AS153NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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