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SN74CB3Q3251PWRG4

Texas Instruments

SN74CB3Q3251PWRG4 by Texas Instruments

SN74CB3Q3251PWRG4 by Texas Instruments is a 16-terminal multiplexer with 8 outputs, operating at a supply voltage range of 2.3V to 3.6V. It features a low propagation delay of 0.18 ns and supports an industrial temperature grade range from -40°C to 85°C. Ideal for applications requiring high-speed signal switching in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,157 parts In-Stock

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Digiode

USA . 3,943 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 637 parts In-Stock

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$11.235

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637

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Parana Technologies

USA . 1,510 parts In-Stock

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$17.087

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$1,586.797

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$15.378

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$17.087

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DigiPath Technology Company

USA . 330 parts In-Stock

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$18.815

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$18.815

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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$19.199

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$18.239

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$17.279

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$19.199

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$17.279

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ChromeModa Solutions

Germany . 1,078 parts In-Stock

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$19.199

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$15.743

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Corohmni

South Africa . 210 parts In-Stock

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$22.226

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Advanced Electronics

New Zealand . 75 parts In-Stock

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$26.867

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$25.523

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$25.523

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75

$26.867

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Semicontronic

India . 628 parts In-Stock

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$44.000

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$42.900

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$42.680

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One Stop Electronics

USA . 899 parts In-Stock

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$45.000

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Ampacity Inc.

Singapore . 1,508 parts In-Stock

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$47.000

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Continental Prestige Electronics

USA . 4,544 parts In-Stock

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Corphita

USA . 4,122 parts In-Stock

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Argo Parts USA

USA . 1,550 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Discover the exceptional quality and reliability of Texas Instruments with the SN74CB3Q3251PWRG4 multiplexer & demultiplexer. This versatile component is perfect for a wide range of applications, providing seamless signal switching and routing. With a compact design and advanced technology, this product offers unmatched value and performance, making it a top choice for engineers and designers looking to optimize their systems. Upgrade your projects with the SN74CB3Q3251PWRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection to the internal components of the multiplexer/demultiplexer.

Surface Mount: YES

The surface mount feature makes it easy to integrate the multiplexer/demultiplexer onto a PCB, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage ensures compatibility with a wide range of systems, making this multiplexer/demultiplexer a versatile choice.

Propagation Delay (tpd): 0.18 ns

The low propagation delay of 0.18 ns ensures fast and efficient data transmission through the multiplexer/demultiplexer.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the multiplexer/demultiplexer to withstand demanding industrial environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signals, enhancing the functionality of the multiplexer/demultiplexer.

Technology: CMOS

The CMOS technology used in this multiplexer/demultiplexer ensures low power consumption and high noise immunity, leading to reliable performance.

Technical Specifications

Multiplexer & Demultiplexer SN74CB3Q3251PWRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Outputs:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

.18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74CB3Q3251PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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