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74AUP1G157GS

NXP Semiconductors

74AUP1G157GS by NXP Semiconductors

74AUP1G157GS by NXP Semiconductors is a compact CMOS multiplexer with a 21.9 ns propagation delay, operating b/w 0.8V and 3.6V. It features a dual terminal design in a thin profile package, suitable for automotive applications. With an operating temp range of -40 °C to 125 °C, it ensures reliability in harsh environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 153,000 parts In-Stock

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Digiode

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Vyrian

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AZTECH Wire

Italy . 3,443 parts In-Stock

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One Stop Electronics

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UNI Independent Distributors

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Northwest PG Solutions

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Corphita

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Native Components

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Supply Digital

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Overview

Unlock unparalleled performance with the 74AUP1G157GS from NXP Semiconductors, a trusted leader in innovative semiconductor solutions. This high-quality multiplexer offers superior reliability and efficiency for various applications, from automotive to consumer electronics. With its compact design and robust temperature range, it’s perfect for modern circuit needs. Experience the blend of cutting-edge technology and exceptional value, enhancing your projects with NXP's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern circuit boards, which saves space and improves performance.

No. of Inputs: 2

Having two inputs makes this multiplexer versatile for handling multiple signal sources, making it suitable for a variety of applications.

Package Shape: SQUARE

The square package shape can facilitate efficient utilization of PCB space, which is crucial in compact designs.

Nominal Supply Voltage / Vsup: 1.1 V

A low nominal supply voltage enhances power efficiency, making it ideal for battery-operated devices.

No. of Terminals: 6

With six terminals, this product allows for sufficient connections, enhancing flexibility in design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile contribute to reduced space requirements on PCBs, enabling more compact electronic designs.

Propagation Delay (tpd): 21.9 ns

A low propagation delay ensures faster switching times, which is crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating allows this device to be used in demanding environments, increasing its application range.

Minimum Operating Temperature: -40 °C

A broad operating temperature range ensures that the product can function reliably in harsh conditions, ideal for automotive and industrial applications.

Terminal Finish: TIN

The tin terminal finish provides good oxidation resistance, ensuring reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB layout and design, facilitating easier routing.

Maximum Seated Height: 0.35 mm

A low seated height allows for low-profile designs, which is key for space-constrained applications.

Width: 1 mm

A compact width aids in reducing overall footprint on a PCB, which is particularly beneficial in portable electronics.

Output Polarity: TRUE

True output polarity ensures straightforward interfacing with CMOS logic, simplifying circuit design.

Minimum Supply Voltage (Vsup): 0.8 V

The ability to operate at a low minimum supply voltage increases the range of applications, especially in low-power situations.

Length: 1 mm

Short length contributes to a minimal footprint, making it easier to fit into tight spaces in electronic designs.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this product is engineered for reliability in rigorous conditions, enhancing its durability.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it suitable for modern electronic devices.

Terminal Form: NO LEAD

No-lead design supports better electrical performance and reduces parasitic capacitance, improving overall signal integrity.

Terminal Pitch: 0.35 mm

A small terminal pitch enables denser packaging of components on a PCB, enhancing design efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

The capability to operate at a maximum supply voltage of 3.6 V allows for compatibility with a wide range of power supplies, enhancing versatility.

Technical Specifications

Multiplexer & Demultiplexer 74AUP1G157GS attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

21.9 ns

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

74AUP1G157GS Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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