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SN74LS257BDRE4

Texas Instruments

SN74LS257BDRE4 by Texas Instruments

SN74LS257BDRE4 by Texas Instruments is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 15 ns at 5V, operates b/w 0-70°C, and features a small outline package for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,273 parts In-Stock

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Digiode

USA . 3,020 parts In-Stock

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3,020

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Distributors (Availability)

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$13.100

100+ parts

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350

$13.100

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Parana Technologies

USA . 1,034 parts In-Stock

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$22.813

100+ parts

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$23.474

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1,034

$22.813

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$23.474

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DigiPath Technology Company

USA . 113 parts In-Stock

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$25.120

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113

$25.120

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ChromeModa Solutions

Germany . 5,464 parts In-Stock

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$25.633

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$21.019

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5,464

$25.633

$21.019

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

1+ parts

$25.633

100+ parts

$24.351

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$23.070

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1,312

$25.633

$24.351

$23.070

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One Stop Electronics

USA . 174 parts In-Stock

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$31.000

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174

$31.000

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Corphita

USA . 3,383 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS257BDRE4 by Texas Instruments, a top-quality multiplexer & demultiplexer that offers reliable performance and precision. With Texas Instruments' reputation for excellence in manufacturing, this versatile component is perfect for a wide range of applications. From data processing to signal routing, this product delivers exceptional value, efficiency, and functionality. Upgrade your designs with the SN74LS257BDRE4 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight construction for easy handling and installation.

Propagation Delay At Nominal Supply: 15 ns

Offers fast response time for efficient data processing.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards.

No. of Functions: 4

Enables multiple functions to be performed simultaneously, increasing versatility.

No. of Inputs: 2

Provides flexibility in the input options for the device.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently on a standard voltage supply.

Load Capacitance (CL): 45 pF

Suitable for handling moderate capacitance loads.

Power Supplies (V): 5

Optimized for use with a 5V power supply.

No. of Terminals: 16

Provides ample connectivity options for various components.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving installation.

Output Characteristics: 3-STATE

Allows for high impedance state when the output is turned off, reducing interference.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, suitable for various environments.

Technology: TTL

Utilizes TTL technology for reliable and efficient performance.

Technical Specifications

Multiplexer & Demultiplexer SN74LS257BDRE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LS257BDRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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